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Proceedings Papers

Response of Topside Structures to Fires and Explosions: Recent Findings

Bassam A. Burgan, Fadi H. Hamdan, Darrell D. Barker, Frank J. Puskar
Proc. ASME. OMAE2003, Volume 2: Safety and Reliability; Pipeline Technology, 155-162, June 8–13, 2003
Paper No: OMAE2003-37183
DOI: https://doi.org/10.1115/OMAE2003-37183
View Paper titled, Response of Topside Structures to Fires and Explosions: Recent Findings
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Topics: Explosions, Fire, Design, Materials properties, Design methodology, Temperature
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.
Journal: Journal of Electronic Packaging
Article Type: Foreword
J. Electron. Packag. June 1995, 117(2): 93.
DOI: https://doi.org/10.1115/1.2792086
Published Online: June 1, 1995
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
DOI: https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach

S. Verma, A. Dasgupta, D. Barker
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 416–423.
DOI: https://doi.org/10.1115/1.2909351
Published Online: December 1, 1993
View Article titled, A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach
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Topics: Fatigue life, Solder joints, Stress, Cycles, Manufacturing, Solders, Temperature, Approximation, Creep, Design
Journal Articles

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

A. Dasgupta, C. Oyan, D. Barker, M. Pecht
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 152–160.
DOI: https://doi.org/10.1115/1.2906412
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
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Topics: Creep, Fatigue, Solders, Temperature, Cycles, Damage, Finite element methods, Solder joints, Stress, Constitutive equations
Journal Articles

Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures

S. M. Bhandarkar, A. Dasgupta, D. Barker, M. Pecht, W. Engelmaier
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 8–13.
DOI: https://doi.org/10.1115/1.2905447
Published Online: March 1, 1992
View Article titled, Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
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Topics: Design, Stress, Thermomechanics, Finite element methods, Failure, Anisotropy, Boundary-value problems, Epoxy adhesives, Epoxy resins, Fatigue life
Journal Articles

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

D. Barker, M. Pecht, A. Dasgupta, S. Naqvi
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 149–155.
DOI: https://doi.org/10.1115/1.2905380
Published Online: June 1, 1991
View Article titled, Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
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Topics: Thermal stresses, Transients (Dynamics), Wave soldering, Stress, Temperature, Anisotropy, Damage, Fatigue life, Fracture (Materials), Heat transfer
Journal Articles

Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach

D. Barker, J. Vodzak, A. Dasgupta, M. Pecht
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 129–134.
DOI: https://doi.org/10.1115/1.2904353
Published Online: June 1, 1990
View Article titled, Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
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Topics: Fatigue, Solder joints, Cycles, Stress, Fatigue life, Reliability, Solders, Approximation, Damage, Failure