1-7 of 7
Byoung Hee You
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing

Juan A. Gomez, Glenn Conner, In-Hyouk Song, Yoo-Jae Kim, Byoung Hee You, Du-Hwan Chun
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A043, November 15–21, 2013
Paper No: IMECE2013-64829
DOI: https://doi.org/10.1115/IMECE2013-64829
View Paper
PDF
Topics: Embossing, Finite element analysis, Molding, Polymers, Cavities, Flow (Dynamics), Temperature, Computer software, Finite element methods, Finite element model
Proceedings Papers

Mold Alignment System for Double-Sided Micro Hot Embossing Using Kinematic Constraints

Glenn Conner, Devanda Lek, Juan A. Gomez, In-Hyouk Song, Taehyun Park, Byoung Hee You
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A035, November 15–21, 2013
Paper No: IMECE2013-63670
DOI: https://doi.org/10.1115/IMECE2013-63670
View Paper
PDF
Topics: Embossing, Kinematics, Tooling
Proceedings Papers

Dimensional and Locational Integrity in the Replication of Polymeric Microdevices

Byoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 955-959, July 8–12, 2007
Paper No: IPACK2007-33482
DOI: https://doi.org/10.1115/IPACK2007-33482
View Paper
PDF
Topics: Dimensions, Embossing, Injection molding, Manufacturing, Microfluidics, Molding, Polymers, Shrinkage (Materials), Thermal expansion
Proceedings Papers

Assembly Tolerance Analysis for Injection Molded Modular, Polymer Microfluidic Devices

Byoung Hee You, Daniel S. Park, P.-C. Chen, Sudheer D. Rani, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 803-809, October 31–November 6, 2008
Paper No: IMECE2008-68143
DOI: https://doi.org/10.1115/IMECE2008-68143
View Paper
PDF
Topics: Manufacturing, Microfluidics, Polymers, Tolerance analysis, Simulation, Brass (Metal), Dimensions, Instrumentation, Mass production, Monte Carlo methods
Proceedings Papers

Replication of Reliable Assembly Features for Polymer Modular Microfluidic Systems

Pin-Chuan Chen, Byoung Hee You, Daniel S. Park, Sunggook Park, Jason Guy, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 119-124, November 11–15, 2007
Paper No: IMECE2007-42206
DOI: https://doi.org/10.1115/IMECE2007-42206
View Paper
PDF
Topics: Manufacturing, Microfluidics, Polymers, Deformation, Design, Kinematics, Microfabrication, Plates (structures), Biomedical microelectromechanical systems, Embossing
Proceedings Papers

Tolerance Variation and Passive Alignment in Modular, Polymer Microfluidic Devices

Byoung Hee You, Daniel S. Park, Christopher W. Mock, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2006, Microelectromechanical Systems, 429-433, November 5–10, 2006
Paper No: IMECE2006-15258
DOI: https://doi.org/10.1115/IMECE2006-15258
View Paper
PDF
Topics: Microfluidics, Polymers, Temperature, Dimensions, Engineering simulation, Simulation, Cavities, Design, Disks, Injection molding
Proceedings Papers

Passive Alignment Structures in Modular, Polymer Microfluidic Devices

Byoung Hee You, Pin-Chuan Chen, Jason Guy, Proyga Datta, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2006, Microelectromechanical Systems, 51-56, November 5–10, 2006
Paper No: IMECE2006-16100
DOI: https://doi.org/10.1115/IMECE2006-16100
View Paper
PDF
Topics: Microfluidics, Polymers, Plates (structures), Brass (Metal), Degrees of freedom, Design, Embossing, Engineering prototypes, Manufacturing, Screws