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Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Paper No: IPACK2022-97886
DOI: https://doi.org/10.1115/IPACK2022-97886
View Paper titled, A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)
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Topics: Design, Heat sinks, Optimization
Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024502.
Paper No: EP-21-1049
DOI: https://doi.org/10.1115/1.4053642
Published Online: February 16, 2022
View Article titled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
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Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Paper No: IPACK2021-72726
DOI: https://doi.org/10.1115/IPACK2021-72726
View Paper titled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
Click here to open pdf in another window PDF for Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, David Huitink, Sarah Myane, Noah Akey, Asif Imran, Fang Luo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 27–29, 2020
Paper No: IPACK2020-2576
DOI: https://doi.org/10.1115/IPACK2020-2576
View Paper titled, Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics
Click here to open pdf in another window PDF for Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics
Topics: Electronics, Nanocomposites
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
DOI: https://doi.org/10.1115/IPACK2019-6442
View Paper titled, Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
Click here to open pdf in another window PDF for Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density