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Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016

Paper No: HT2016-7043

DOI: https://doi.org/10.1115/HT2016-7043

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Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization

Proceedings Papers

Thermal Model of a Thin Film Pulsed Pyroelectric Generator

Nicholas R. Jankowski, Andrew N. Smith, Brendan M. Hanrahan

Paper No: HT2016-7437

DOI: https://doi.org/10.1115/HT2016-7437

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Topics: Generators, Thin films, Cycles, Temperature, Energy conversion, Energy generation, Heating, Thermodynamic cycles, Transients (Dynamics), Brayton cycle

Journal Articles

Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy

Andrew N. Smith, Nicholas R. Jankowski, Lauren M. Boteler

J. Heat Transfer. April 2016, 138(4): 041301.

Paper No: HT-15-1199

DOI: https://doi.org/10.1115/1.4032172

Published Online: January 20, 2016

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Topics: Heat, Interfacial thermal resistance, Steady state, Temperature, Uncertainty, Microscopy, Thermal resistance, Temperature gradient, Heat flux

Proceedings Papers

Interfacial Resistance Measurement of High Performance Thermal Interface Materials

Andrew N. Smith, Nicholas Jankowski, Lauren Boteler, Christopher Meyer

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A003, July 14–19, 2013

Paper No: HT2013-17507

DOI: https://doi.org/10.1115/HT2013-17507

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Topics: Interfacial thermal resistance, Temperature, ASTM International, Resolution (Optics), Heat, Uncertainty, Microscopes, Preforms, Probes, Resistance thermometers

Proceedings Papers

Design of a Heat Sink in an Undergraduate Heat Transfer Course

Andrew N. Smith, Ralph J. Volino, Karen A. Flack

Proc. ASME. IMECE2012, Volume 5: Education and Globalization; General Topics, 323-328, November 9–15, 2012

Paper No: IMECE2012-89077

DOI: https://doi.org/10.1115/IMECE2012-89077

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Topics: Design, Heat sinks, Heat transfer, Undergraduate students, Students, Fins, Electrical discharge machining, Flow (Dynamics), Flow simulation, Wire

Proceedings Papers

Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

Robert J. Stevens, Andrew N. Smith, Arthur W. Lichtenberger, Pamela M. Norris

Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 239-245, November 15–21, 2003

Paper No: IMECE2003-41856

DOI: https://doi.org/10.1115/IMECE2003-41856

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Topics: Dielectric materials, Interfacial thermal resistance, Metals, Top-tensioned risers, Electrical conductance, Temperature, Gallium nitride, Metallic films, Sapphire, Signals

Proceedings Papers

Determination of the Directional Dependent In-Plane Thermal Conductivity of K63B12 Pitch-Fiber/Epoxy Composite

Jessica N. McClay, Peter Joyce, Andrew N. Smith

Proc. ASME. IMECE2004, Innovations in Engineering Education: Mechanical Engineering Education, Mechanical Engineering/Mechanical Engineering Technology Department Heads, 305-310, November 13–19, 2004

Paper No: IMECE2004-60001

DOI: https://doi.org/10.1115/IMECE2004-60001

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fibers, Thermal conductivity, Density, Steady state, Thermal management

Proceedings Papers

Investigation of Elliptical Cooling Channels for a Naval Electromagnetic Railgun

Elizabeth R. Kealey, Peter J. Joyce, Martin Cerza, Andrew N. Smith

Proc. ASME. IMECE2005, Heat Transfer, Part B, 89-97, November 5–11, 2005

Paper No: IMECE2005-81586

DOI: https://doi.org/10.1115/IMECE2005-81586

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Topics: Cooling, Design, Stress concentration, Heat flux, Shapes, Compressive stress, Convection, Copper, Cross section (Physics), Electrical discharge machining

Journal Articles

Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

Robert J. Stevens, Andrew N. Smith, Pamela M. Norris

J. Heat Transfer. March 2005, 127(3): 315–322.

DOI: https://doi.org/10.1115/1.1857944

Published Online: March 24, 2005

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Topics: Electrical conductance, Metallic films, Metals, Phonons, Sapphire, Spectra (Spectroscopy), Temperature, Thermal conductivity, Thermoreflectance, Top-tensioned risers

Journal citation

NARROW

Theoretical Determination of the Laser Induced Damage Threshold for Ultrashort Pulse Laser Heating of Metal Films

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Thermal Model of a Thin Film Pulsed Pyroelectric Generator

Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy

Interfacial Resistance Measurement of High Performance Thermal Interface Materials

Design of a Heat Sink in an Undergraduate Heat Transfer Course

Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

Determination of the Directional Dependent In-Plane Thermal Conductivity of K63B12 Pitch-Fiber/Epoxy Composite

Investigation of Elliptical Cooling Channels for a Naval Electromagnetic Railgun

Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

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