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Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011

Paper No: IPACK2011-52140

DOI: https://doi.org/10.1115/IPACK2011-52140

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Topics: Energy efficiency, Data centers, Energy consumption, Traction

Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein

Paper No: IPACK2011-52141

DOI: https://doi.org/10.1115/IPACK2011-52141

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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors

Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader

Paper No: IPACK2011-52030

DOI: https://doi.org/10.1115/IPACK2011-52030

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Topics: Cooling, Cooling towers, Data centers, Energy efficiency, Leakage, Modeling, Operating temperature, Energy consumption, Heat, Accounting

Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash

J. Electron. Packag. September 2011, 133(3): 031008.

DOI: https://doi.org/10.1115/1.4004657

Published Online: September 21, 2011

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Topics: Cooling, Cooling towers, Data centers, Heat sinks, Temperature, Temperature control, Modeling, Thermal resistance, Flow (Dynamics)

Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash

J. Electron. Packag. March 2011, 133(1): 011004.

DOI: https://doi.org/10.1115/1.4003274

Published Online: March 9, 2011

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Topics: Cooling, Cooling towers, Data centers, Temperature, Cooling systems, Heat, Modeling, Flow (Dynamics)

Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10074, March 13–17, 2011

Paper No: AJTEC2011-44091

DOI: https://doi.org/10.1115/AJTEC2011-44091

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Topics: Containment, Cooling towers, Data centers, Modeling, Energy efficiency, Cooling systems, Air flow, Computers, Temperature, Cooling

Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009

Paper No: InterPACK2009-89032

DOI: https://doi.org/10.1115/InterPACK2009-89032

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Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization

Proceedings Papers

An Exergy-Based Framework for Assessing Sustainability of IT Systems

Amip J. Shah, Milton Meckler

Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 1, 823-832, July 19–23, 2009

Paper No: ES2009-90028

DOI: https://doi.org/10.1115/ES2009-90028

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Topics: Exergy, Sustainability, Boundary-value problems, Cycles, Life cycle assessment, Thermodynamics

Proceedings Papers

Exergy-Based Environmental Design of a Computer Room Air Conditioning Unit

David J. Lettieri, Amip J. Shah, Van P. Carey

Proc. ASME. IMECE2009, Volume 6: Emerging Technologies: Alternative Energy Systems; Energy Systems: Analysis, Thermodynamics and Sustainability, 411-420, November 13–19, 2009

Paper No: IMECE2009-11461

DOI: https://doi.org/10.1115/IMECE2009-11461

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Topics: Air conditioning, Computers, Design, Exergy, Data centers, Energy consumption, Manufacturing, Raw materials, Transportation systems

Proceedings Papers

Use of Thermodynamics, Engineering Economics and Probabilistic Risk Assessment in Evaluating Climate Change Decisions

Milton Meckler, Amip J. Shah

Proc. ASME. IMECE2009, Volume 8: Engineering to Address Climate Change; Sustainable Products and Processes, 27-34, November 13–19, 2009

Paper No: IMECE2009-10182

DOI: https://doi.org/10.1115/IMECE2009-10182

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Topics: Climate change, Engineering economy, Probabilistic risk assessment, Thermodynamics, Design, Power stations, Cogeneration plants, Electric power generation, Electricity (Physics), Electronic systems

Journal Articles

Exergo-Thermo-Volumes: An Approach for Environmentally Sustainable Thermal Management of Energy Conversion Devices

Amip J. Shah, Chandrakant D. Patel

J. Energy Resour. Technol. June 2010, 132(2): 021002.

DOI: https://doi.org/10.1115/1.4001569

Published Online: May 17, 2010

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Topics: Cooling, Design, Energy conversion, Exergy, Fuel cells, Heat, Sustainability, Thermal management, Energy consumption, Cycles

Proceedings Papers

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 887-894, July 8–12, 2007

Paper No: IPACK2007-33044

DOI: https://doi.org/10.1115/IPACK2007-33044

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Topics: Cavities, Compression, Deformation, Packaging, Vehicles

Proceedings Papers

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

Amip J. Shah, Anita Rogacs, Chandrakant D. Patel

Proc. ASME. HT2008, Heat Transfer: Volume 2, 653-662, August 10–14, 2008

Paper No: HT2008-56210

DOI: https://doi.org/10.1115/HT2008-56210

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Topics: Computers, Energy efficiency, Optimization, Thermal management, Cooling, Data centers, Density, Energy consumption, Temperature, Compacting

Proceedings Papers

Designing Environmentally Sustainable Electronic Cooling Systems Using Exergo-Thermo-Volumes

Amip J. Shah, Chandrakant D. Patel

Proc. ASME. ES2008, ASME 2008 2nd International Conference on Energy Sustainability, Volume 1, 19-27, August 10–14, 2008

Paper No: ES2008-54089

DOI: https://doi.org/10.1115/ES2008-54089

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Topics: Computer cooling, Design, Sustainability, Exergy, Cooling, Entropy, Energy consumption, Engineers, Flow (Dynamics), Fluid dynamics

Journal citation

NARROW

Design of a Mobility Mechanism for a Rescue and Surveillance Vehicle

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Quantifying Equilibria Shifts due to Externalities

Evaluating Supply Chain Energy Use in a Smart Grid Paradigm

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Integrated Design and Management of a Sustainable Data Center

An Exergy-Based Framework for Assessing Sustainability of IT Systems

Exergy-Based Environmental Design of a Computer Room Air Conditioning Unit

Use of Thermodynamics, Engineering Economics and Probabilistic Risk Assessment in Evaluating Climate Change Decisions

Exergo-Thermo-Volumes: An Approach for Environmentally Sustainable Thermal Management of Energy Conversion Devices

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

Designing Environmentally Sustainable Electronic Cooling Systems Using Exergo-Thermo-Volumes

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