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Albert Chan
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 97-102, July 6–11, 2003
Paper No: IPACK2003-35041
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 667-670, November 15–21, 2003
Paper No: IMECE2003-42344