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Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Paper No: IPACK2021-72726
DOI: https://doi.org/10.1115/IPACK2021-72726
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Paper No: IPACK2017-74213
DOI: https://doi.org/10.1115/IPACK2017-74213
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

High Temperature SiC Power Module Packaging

Brian Rowden, Alan Mantooth, Simon Ang, Alex Lostetter, Jared Hornberger, Brice McPherson
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 85-90, November 13–19, 2009
Paper No: IMECE2009-12883
DOI: https://doi.org/10.1115/IMECE2009-12883
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Topics: High temperature, Packaging, Tension-leg platforms, Bonding, Silicon, Temperature, Blocks (Building materials), Bridges (Structures), Circuits, Distributed power generation