The method of roll molding is proposed as an alternative to compression molding for low-cost, high-throughput manufacturing of metal-based microchannel structures. Elemental aluminum- and copper- based microchannel arrays with depths of ∼600 μm and depth:width ratios ≥2:1 were successfully fabricated by roll molding at room temperature. Morphologies of roll molded Al and Cu microchannels were examined in detail. Response of roll molding was characterized by measuring depths of roll molded microchannels as a function of the normal loading force per width. This response of roll molding was further shown to scale with the flow stress of roll molded material. Roll molding offers the potential of fabricating microchannel structures with large footprints in a continuous manner.
Issue Section:
Research Papers
Topics:
Manufacturing,
Microchannels,
Molding,
Rollers,
Sheet metal,
Strips,
Stress,
Flow (Dynamics)
References
1.
Tuckerman
, D. B.
, and Pease
, R. F. W.
, 1981
, “High Performance Heat Sinking for VLSI
,” IEEE Electron Device Lett.
, 2
, pp. 126
–129
.10.1109/EDL.1981.253672.
Incropera
, F. P.
, and De Witt
, D. P.
, 2002
, Fundamentals of Heat and Mass Transfer
, 5th ed., Wiley
, New York
.3.
Lu
, B.
, Chen
, K.
, Meng
, W. J.
, and Mei
, F.
, 2010
, “Fabrication, Assembly and Heat Transfer Testing of Low-Profile Copper-Based Microchannel Heat Exchangers
,” J. Micromech. Microeng.
, 20
, p. 115002
.10.1088/0960-1317/20/11/1150024.
Benavides
, G. L.
, Bieg
, L. F.
, Saavedra
, M. P.
, and Bryce
, E. A.
, 2002
, “High Aspect Ratio Meso-Scale Parts Enabled by Wire Micro-EDM
,” Microsyst. Technol.
, 8
(6
), pp. 395
–401
.10.1007/s00542-002-0190-x5.
Adams
, D. P.
, Vasile
, M. J.
, Benavides
, G.
, and Campbell
, A. N.
, 2001
, “Micromilling of Metal Alloys With Focused Ion Beam-Fabricated Tools
,” Precis. Eng.
, 25
(2
), pp. 107
–113
.10.1016/S0141-6359(00)00064-76.
Lorenz
, R. M.
, Kuyper
, C. L.
, Allen
, P. B.
, Lee
, L. P.
, and Chiu
, D. T.
, 2004
, “Direct Laser Writing on Electrolessly Deposited Thin Metal Films for Applications in Micro- and Nano Fluidics
,” Langmuir
, 20
(5
), pp. 1833
–1837
.10.1021/la036047q7.
Cao
, D. M.
, Guidry
, D.
, Meng
, W. J.
, and Kelly
, K. W.
, 2003
, “Molding of Pb and Zn With Microscale Mold Inserts
,” Microsyst. Technol.
, 9
(8
), pp. 559
–566
.10.1007/s00542-003-0308-98.
Cao
, D. M.
, and Meng
, W. J.
, 2004
, “Microscale Compression Molding of Al With Surface Engineered LiGA Inserts
,” Microsyst. Technol.
, 10
(8/9
), pp. 662
–670
.10.1007/s00542-004-0440-19.
Cao
, D. M.
, Jiang
, J.
, Meng
, W. J.
, Jiang
, J. C.
, and Wang
, W.
, 2007
, “Fabrication of High-Aspect-Ratio Microscale Ta Mold Inserts With Micro-Electrical-Discharge-Machining
,” Microsyst. Technol.
, 13
(5/6
), pp. 503
–510
.10.1007/s00542-006-0198-810.
Jiang
, J.
, Mei
, F.
, and Meng
, W. J.
, 2008
, “Fabrication of Metal-Based High-Aspect-Ratio Microscale Structures by Compression Molding
,” J. Vac. Sci. Technol. A
, 26
(4
), pp. 745
–751
.10.1116/1.291207811.
Madou
, M.
, 2000
, Fundamentals of Microfabrication
, CRC Press
, Boca Raton, FL
.12.
Tan
, H.
, Gilbertson
, A.
, and Chou
, S. Y.
, 1998
, “Roller Nanoimprint Lithography
,” J. Vac. Sci. Technol. B
, 16
(6
), pp. 3926
–3928
.10.1116/1.59043813.
Lan
, S.
, Song
, J. H.
, Lee
, M. G.
, Ni
, J.
, Lee
, N. K.
, and Lee
, H. J.
, 2010
, “Continuous Roll-to-Flat Thermal Imprinting Process for Large-Area Micro-Pattern Replication on Polymer Substrate
,” Microelectron. Eng.
, 87
(12
), pp. 2596
–2601
.10.1016/j.mee.2010.07.02114.
Youn
, S. W.
, Ogiwara
, M.
, Goto
, H.
, Takahashi
, M.
, and Maeda
, R.
, 2008
, “Prototype Development of a Roller Imprint System and Its Application to Large Area Polymer Replication for a Microstructured Optical Device
,” J. Mater. Process. Technol.
, 202
(1–3
), pp. 76
–85
.10.1016/j.jmatprotec.2007.08.06915.
Maury
, P.
, Turkenburg
, D.
, Stroeks
, N.
, Giesen
, P.
, Barbu
, I.
, Meinders
, E.
, van Bremen
, A.
, Iosad
, N.
, van der Werf
, R.
, and Onvlee
, H.
, 2011
, “Roll-to-Roll UV Imprint Lithography for Flexible Electronics
,” Microelectron. Eng.
, 88
(8
), pp. 2052
–2055
.10.1016/j.mee.2011.02.02216.
Sjöström
, T.
, and Su
, B.
, 2011
, “Micropatterning of Titanium Surfaces Using Electrochemical Micromachining With an Ethylene Glycol Electrolyte
,” Mater. Lett.
, 65
(23–24
), pp. 3489
–3492
.10.1016/j.matlet.2011.07.10317.
Sabella
, S.
, Shiv Shankar
, S.
, Vecchio
, G.
, Brunetti
, V.
, Rizzello
, L.
, Qualtieri
, A.
, Martiradonna
, L.
, Cingolani
, R.
, and Pompa
, P. P.
, 2010
, “Room-Temperature Metal Stamping by Microfluidics
,” Mater. Lett.
, 64
, pp. 41
–44
.10.1016/j.matlet.2009.09.06618.
Zhou
, R.
, Cao
, J.
, Ehmann
, K.
, and Xu
, C.
, 2011
, “An Investigation on Deformation-Based Surface Texturing
,” ASME J. Manuf. Sci. Eng.
, 133
(6
), p. 061017
.10.1115/1.400545919.
Groover
, M. P.
, 2010
, Fundamentals of Modern Manufacturing: Materials Processes, and Systems
, 4th ed., Wiley
, Hoboken, NJ
.20.
2004
, ASM Handbook
Vol. 9
: Metallography and Microstructures
, ASM International
, Materials Park, OH
.21.
Meyers
, M. A.
, and Chawla
, K. K.
, 1984
, Mechanical Metallurgy: Principles and Applications
, Prentice Hall
, New Jersey
.22.
Tabor
, D.
, 2000
, The Hardness of Metals
, Clarendon
, Oxford
.23.
ImageJ is an Open Access Software Supplied by the Research Services Branch of National Institutes of Health. Additional Information can be Obtained from http://rsbweb.nih.gov/
24.
Mei
, F.
, Chen
, K.
, Jiang
, J.
, and Meng
, W. J.
, 2010
, “Scaling the Response of Microscale Compression Molding of Elemental Cu in the Presence of Dynamic Recrystallization
,” Acta Mater.
, 58
, pp. 2638
–2645
.10.1016/j.actamat.2009.12.05025.
Lu
, B.
, Meng
, W. J.
, and Mei
, F.
, 2013
, “Experimental Investigation of Cu-Based, Double-Layered, Microchannel Heat Exchangers
,” J. Micromech. Microeng.
, 23
, p. 035017
.10.1088/0960-1317/23/3/035017Copyright © 2014 by ASME
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