1-1 of 1
Keywords: ultrasonic vibration helical grinding
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiC f /SiC Composites

Zhigang Dong, Haitao Zhang, Yan Bao, Feng Yang, Zhongwang Wang, Renke Kang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2023, 145(5): 051008.
Paper No: MANU-22-1387
DOI: https://doi.org/10.1115/1.4056595
Published Online: January 30, 2023
...Zhigang Dong; Haitao Zhang; Yan Bao; Feng Yang; Zhongwang Wang; Renke Kang To reveal the material removal mechanism of silicon carbide fiber reinforced silicon carbide ceramic matrix (SiC f /SiC) composites during the ultrasonic vibration helical grinding (UVHG) of hole-making process, a hole...
View Article titled, Material Removal Behavior of <span class="search-highlight">Ultrasonic</span> <span class="search-highlight">Vibration</span> <span class="search-highlight">Helical</span> <span class="search-highlight">Grinding</span> of SiC f &#x2F;SiC Composites
Click here to open pdf in another window PDF for Material Removal Behavior of <span class="search-highlight">Ultrasonic</span> <span class="search-highlight">Vibration</span> <span class="search-highlight">Helical</span> <span class="search-highlight">Grinding</span> of SiC f /SiC Composites
Topics: Composite materials, Fibers, Fracture (Materials), Fracture (Process), Grinding, Surface quality, Surface topography, Vibration, Surface roughness, Grinding wheels