Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics. In this study, an improved model for analyzing the grain depth-of-cut in ultra-fine rotational grinding is proposed, in which the minimum grain depth-of-cut for chip formation, the equivalent grain cutting tip radius, elastic recovery deformation in cutting process, and the actual number of effective grains are considered in the prediction of the ultrafine rotational grinding of brittle materials. The improved model is validated experimentally and shows higher accuracy than the existing model. Furthermore, the sensitivity of the grain depth-of-cut to three introduced factors is analyzed, presenting the necessity of the consideration of these factors during the prediction of grain depth-of-cut in ultrafine grinding.
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December 2018
Research-Article
Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
Bin Lin,
Bin Lin
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
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Ping Zhou,
Ping Zhou
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn
Search for other works by this author on:
Ziguang Wang,
Ziguang Wang
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
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Ying Yan,
Ying Yan
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
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Renke Kang,
Renke Kang
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
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Dongming Guo
Dongming Guo
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Search for other works by this author on:
Bin Lin
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Ping Zhou
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn
Ziguang Wang
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Ying Yan
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Renke Kang
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Dongming Guo
Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
1Corresponding author.
Manuscript received February 24, 2018; final manuscript received August 14, 2018; published online September 17, 2018. Assoc. Editor: Zhijian (ZJ) Pei.
J. Manuf. Sci. Eng. Dec 2018, 140(12): 121001 (7 pages)
Published Online: September 17, 2018
Article history
Received:
February 24, 2018
Revised:
August 14, 2018
Citation
Lin, B., Zhou, P., Wang, Z., Yan, Y., Kang, R., and Guo, D. (September 17, 2018). "Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer." ASME. J. Manuf. Sci. Eng. December 2018; 140(12): 121001. https://doi.org/10.1115/1.4041245
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