... 2012 13 02 2012 heat transfer phase change materials pipe flow thermal management (packaging) two-phase flow micro-encapsulated phase change material thermal boundary layer enhancement of heat transfer Details of the experimental setup and data analysis are given...

... exchangers plates (structures) thermal management (packaging) equivalent fin height heat flow choke forced cooled electronic chassis unequal heat loading Interest in the forced cooled electronic chassis or cold plate to provide an acceptable microclimate for electronic components within...

... micromechanical devices nanofabrication nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) heat pipe electronic cooling evaporation The thermal management of high-power-density semiconductor devices...

... 03 02 2011 boiling cooling elemental semiconductors microchannel flow silicon thermal management (packaging) pool boiling heat transfer enhancement microchannels grooves bubble dynamics During pool boiling, the latent heat involved with the phase change from liquid...

... , W. M. , and London , A. L. , 1964 , Compact Heat Exchangers , 2nd ed. , McGraw-Hill , New York . 10 05 2010 14 11 2010 02 02 2011 02 02 2011 carbon foams forced convection heat sinks thermal management (packaging) carbon foam thermal management...

... , 46 , pp. 4059 – 4070 . 10.1016/S0017-9310(03)00226-6 02 06 2009 24 11 2009 28 04 2010 28 04 2010 boiling copper dendrites dielectric liquids flow through porous media heat transfer microfluidics nanoporous materials thermal management (packaging) pool...

... finite volume methods Galerkin method heat transfer matrix decomposition thermal management (packaging) Practical applications of computational fluid dynamics (CFD) for heat transfer analysis often present situations where a complex 3D object may be used in several locations within a system...

... annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure In new-generation microelectronic systems, the increase in power dissipation requires compact...

... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...

... sinks heat transfer laminar flow microchannel flow thermal management (packaging) 30 09 2008 11 04 2009 18 02 2010 18 02 2010 2010 American Society of Mechanical Engineers ...

... . 12 03 2008 13 11 2008 13 04 2009 cooling heat conduction PD control Peltier effect temperature control thermal management (packaging) thermoelectric devices thermo-electric cooling thermal control conduction thermal management Passive thermal control...

... 2008 aerodynamics cooling fans heat conduction heat sinks thermal management (packaging) turbulence electronics cooling low profile portable electronics radial fans and heat sinks thermal management Performance and profile, or height, are two features that give companies...

... microprocessor chips porosity silicon statistical analysis thermal management (packaging) thermal resistance heat pipe vapor chamber nonuniform heating evaporative thermal performance silicon die heater As integrated circuit (IC) technology evolves for microprocessors, components inside IC...

... pressures. Thermal resistances increased as CNT array growth temperature decreased primarily due to a reduction in the average diameter of CNTs in the arrays. carbon nanotubes photoacoustic effect plasma CVD silicon silver thermal conductivity thermal management (packaging) thermal resistance...

... at an optimum location in either impingement or cross flow position, it can provide similar enhancements. cooling heat transfer jets microfluidics thermal management (packaging) synthetic jets electronics cooling thermal management impingement jet design Synthetic jets have been...

... phase change materials thermal management (packaging) paraffin graphite nanofiber phase change material (PCM) thermal management Phase change materials (PCMs) are materials that undergo a phase transformation, typically the solid-liquid phase transformation, at a temperature within...

... energy conservation and potential economic savings. exergy second-law analysis data center thermal management electronics cooling energy efficiency air conditioning cooling thermal management (packaging) total energy systems 10 07 2006 25 05 2007 04 02 2008...

... integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has become one of the key design challenges for microelectronics as the total thermal design power (TDP...

... management (packaging) flat evaporator novel design electronic cooling miniature loop heat pipe mLHP thermal control Loop heat pipes (LHPs) are two-phase heat transfer devices that depend on the capillary forces developed in a fine pore wick to circulate the working fluid in the closed...

...://webbook.nist.gov . 21 07 2006 18 01 2007 cooling thermal management (packaging) heat sinks microchannel flow sprays nozzles spray cooling thermal management fins heat sink evaporation With chip heat fluxes predicted to continue to rise past what is practical for air...