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Keywords: micromechanical devices
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Journal Articles
Article Type: Research Papers
J. Heat Transfer. March 2012, 134(3): 031008.
Published Online: January 13, 2012
... illustrate the methodology through selected examples, with a focus on information technology systems. 25 08 2010 23 05 2011 13 01 2012 13 01 2012 design engineering finite element analysis heat transfer micromechanical devices optimisation transport processes reduced...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. October 2011, 133(10): 101502.
Published Online: August 11, 2011
... micromechanical devices nanofabrication nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) heat pipe electronic cooling evaporation The thermal management of high-power-density semiconductor devices...
Journal Articles
Article Type: Guest Editorial
J. Heat Transfer. June 2011, 133(6): 060301.
Published Online: March 7, 2011
.... convection cooling foams heat sinks microfabrication micromechanical devices two-phase flow 07 03 2011 07 03 2011 2011 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 2010, 132(11): 111801.
Published Online: August 10, 2010
... include the axial length, temperature range, mass flow rate, and working fluid. 04 02 2009 01 10 2009 10 08 2010 10 08 2010 cryogenics flow through porous media heat exchangers heat transfer micromechanical devices plates (structures) perforated plate heat exchanger...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. July 2010, 132(7): 072402.
Published Online: April 28, 2010
... , Melville, NY . 18 05 2009 10 12 2009 28 04 2010 28 04 2010 elemental semiconductors finite element analysis heat conduction micromechanical devices Raman spectra silicon thermometers Raman thermometry MEMS finite element heat conduction simulations...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 2010, 132(5): 052403.
Published Online: March 9, 2010
... annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure In new-generation microelectronic systems, the increase in power dissipation requires compact...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 2009, 131(11): 111402.
Published Online: August 26, 2009
... 2009 26 08 2009 heat transfer jets micromechanical devices orifices (mechanical) electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient Due to the increasing power consumption and decreasing size of electronic chips, cooling...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 2009, 131(5): 051401.
Published Online: March 20, 2009
... 03 2009 forced convection heat exchangers lithography microchannel flow micromechanical devices silicon sputter etching microchannel cooler constructal theory fractal geometry constructal trees electronic cooling single phase forced convection GaN SiC In recent...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 2009, 131(5): 052401.
Published Online: March 16, 2009
... apparent thermal conductivity than a silica aerogel, which has an apparent thermal conductivity of 0.03   W / m   K when the cold-side temperature is 294 K ( 5 ). micro-insulation MEMS microscale cells (electric) heat conduction insulation micromechanical devices...
Journal Articles
Article Type: Micro/Nanoscale Heat Transfer—Part Ii
J. Heat Transfer. April 2009, 131(4): 043201.
Published Online: February 11, 2009
... 2008 11 02 2009 micromechanical devices silicon thermal conductivity thermal conductivity 3ω technique polycrystalline silicon suspended microbridge thermal boundary resistance The characteristic lengths of material features contained in microelectronic devices...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. September 2008, 130(9): 091601.
Published Online: July 3, 2008
... adjusted and controlled. They are widely used as thermal flow sensors, microbolometers, Joule heating igniters, infrared sources, gas sensors, etc. ( 1 2 3 4 ). contact resistance thermal probes calibration thermocouple microhotplate calibration contact resistance micromechanical...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. August 2008, 130(8): 084501.
Published Online: May 29, 2008
... micromechanical devices nucleate boiling bubble behavior MEMS artificial cavity Since boiling heat transfer has a high heat transfer coefficient, it has been used as a cooling technique for high-temperature bodies. The boiling phenomena have been investigated for more than 60 – 70 years...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. April 2008, 130(4): 042403.
Published Online: March 17, 2008
... transfer latent heat mass transfer membranes microfluidics micromechanical devices polymers supports microtruss architecture latent heat transfer mass transfer pore diffusion MEMS nanotechnology membrane polymers soft materials evaporation nonboiling evaporative cooling phase...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 2008, 130(2): 022401.
Published Online: February 4, 2008
... that multiple-phonon processes are contributing to interfacial transport at high temperatures. 24 07 2006 14 06 2007 04 02 2008 alumina aluminium chromium dielectric materials interface phonons micromechanical devices phonon-phonon interactions platinum silicon thermal...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. July 2007, 129(7): 798–804.
Published Online: August 14, 2006
.... Preliminary experimental results show that the temperature drop is inline with that theoretically predicted. 02 02 2006 14 08 2006 thermal analysis micromechanical devices temperature control aerospace components lightweight structures temperature distribution laser materials...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. March 2007, 129(3): 329–334.
Published Online: May 31, 2006
... ,” Appl. Phys. Lett. 0003-6951 10.1063/1.114125 , 66 ( 26 ), pp. 3639 – 3641 . 17 01 2006 31 05 2006 silicon elemental semiconductors micromechanical devices coherent antiStokes Raman scattering spectral line breadth thermal stresses calibration spectral methods...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. June 2004, 126(3): 453–462.
Published Online: June 16, 2004
... evaporation heat pipes LIGA cooling channel flow micromechanical devices gravity lithography electrodeposition Channel Flow Evaporation Heat Transfer Heat Pipes Microscale Evaporative cooling devices such as heat pipes and capillary pumped loops utilize capillary suction to draw...
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. April 2002, 124(2): 375–382.
Published Online: October 18, 2001
... Transfer Division for publication in the JOURNAL OF HEAT TRANSFER . Manuscript received by the Heat Transfer Division April 26, 2001; revision received October 18, 2001. Associate Editor: G. P. Peterson. 26 April 2001 18 October 2001 silicon bubbles resistors micromechanical...
Journal Articles
Article Type: Technical Notes
J. Heat Transfer. April 2002, 124(2): 394–396.
Published Online: August 6, 2001
... August 6, 2001. Associate Editor: A. Majumdar. 18 December 2000 06 August 2001 adhesion micromechanical devices laser beam applications high-speed optical techniques maintenance engineering stiction Experimental Laser Microscale Microstructures Surface Adhesion...