Results from an experimental study on the rapid measurement of thermal conductivity of chemical vapor deposited (CVD) diamond films are presented. The classical thermal comparator method has been used successfully in the past for the measurement of thermal conductivity of bulk materials having high values of thermal resistance. Using samples of known thermal conductivity, a calibration curve is prepared. With this calibration curve, the comparator can be used to determine thermal conductivity of unknown samples. We have significantly modified and extended this technique for the measurement of materials with very low thermal resistance, i.e., CVD diamond films with high thermal conductivity. In addition to the heated probe, the modified comparator employs a thermoelectric cooling element of increase conductive heat transfer through the film. The thermal conductivity measurements are sensitive to many other factors such as the thermal contact resistances, anisotropic material properties, surrounding air currents and temperature, and ambient humidity. A comprehensive numerical model was also developed to simulate the heat transfer process for the modified comparator. The simulations were used to develop a “numerical” calibration curve that agreed well with the calibration curve obtained from our measurements. The modified method has been found to successfully measure the thermal conductivity of CVD diamond films. [S0022-1481(00)00804-5]

Issue Section:
Heat Transfer in Manufacturing
Keywords:
Condensation, Experimental, Heat Transfer, Measurement Techniques, Probes, diamond, thermal conductivity measurement, CVD coatings, thermal resistance, calibration, humidity
Topics:
Calibration, Heat transfer, Probes, Synthetic diamonds, Temperature, Thermal conductivity, Thermal conductivity measurement, Diamonds, Computer simulation, Stress, Thermal resistance
1.
Graebner
,
J. E.
,
Reiss
,
M. E.
, and
Seibles
,
L.
,
1994
, “
Phonon Scattering in Chemical-Vapor Deposited Diamond
,”
Phys. Rev. B
,
50
, pp.
3702
–
3713
.
2.
Holman, J. P., 1984, Experimental Methods for Engineers, 4th Ed., McGraw-Hill, New York.
3.
Sanders
,
D. J.
, and
Forsyth
,
R. C.
,
1983
, “
Measurement of Thermal Conductivity and Contact Resistance of Paper and Thin-Film Materials
,”
Rev. Sci. Instrum.
,
54
, pp.
238
–
244
.
4.
Powell, R. W., 1969, “Measurement Conductivity Determinations by the Thermal Comparator Methods,” R. P. Tye, Ed., Thermal Conductivity, Vol. 2, Academic Press, San Diego, pp. 275–338.
5.
Lambropoulos
,
J. C.
,
Jolly
,
M. R.
,
Amsden
,
C. A.
,
Gilman
,
S. E.
,
Sinicropi
,
M. J.
,
Diakomihalis
,
D.
, and
Jacobs
,
S. D.
,
1989
, “
Thermal Conductivity of Dielectric Thin Films
,”
J. Appl. Phys.
,
66
, No.
9
, pp.
4230
–
4242
.
6.
Mesyngier, C., Farouk, B., Lee, Y. H., Yi, G. W., and Brown, D. W., 1998, “Thermal Conductivity of DLC (Diamond-like Carbon) Thin Films and its Relation to Mechanical and Chemical Properties,” Proceedings of Thermal Conductivity 24, Technomic, Lancaster, PA, pp. 538–548.
7.
Kittel, C., 1996, Introduction to Solid-State Physics, 7th Ed., John Wiley and Sons, New York.
8.
Graebner, J. E, 1996, “Measurements of Specific Heat and Mass Density in CVD Diamond,” Diamond and Related Materials, 5, pp. 1366–1370.
9.
Anthony
,
T. R.
,
Banholzer
,
W. F.
,
Fleischer
,
J. F.
,
Wei
,
L.
,
Kuo
,
P. K.
,
Thomas
,
R. L.
, and
Pryor
,
R. W.
,
1990
, “
Thermal Diffusivity of Isotropically Enriched 12C Diamond
,”
Phys. Rev. B
,
42
, pp.
1104
–
1111
.
10.
Graebner
,
J. E.
,
Jin
,
S.
,
Kammlott
,
G. W.
,
Herb
,
J. A.
, and
Gardinier
,
C. F.
,
1992
, “
Large Anisotropic Thermal Conductivity in Synthetic Diamond Films
,”
Nature (London)
,
359
, pp.
401
–
403
.
11.
Feldman, A., Frederiske, P. R., and Ying, X. T., 1989, “Thermal Wave Measurements of the Thermal Properties of CVD Diamond,” Diamond Optics II, SPIE, Vol. 1146, pp. 78–84.
12.
Timoshenko, S. P., and Goodier, J. N., 1951, Theory of Elasticity, 2nd Ed., McGraw-Hill, New York.
13.
Incropera, P. F., and DeWitt, P. D., 1996, Fundamentals of Heat and Mass Transfer, 4th Ed., John Wiley and Sons, New York.
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