Pool boiling heat transfer with the use of femtosecond laser surface processing (FLSP) on copper surfaces has been studied. FLSP creates a self-organized micro/nanostructured surface. In the previous pool boiling heat transfer studies with stainless steel FLSP surfaces, enhancements in critical heat flux (CHF) and heat transfer coefficients (HTCs) were observed compared to the polished reference surface. However, this study shows that copper FLSP surfaces exhibit reductions in both CHF and HTCs consistently. This reduction in heat transfer performance is a result of an oxide layer that covers the surface of the microstructures and acts as an insulator due to its low thermal conductivity. The oxide layer was observed and measured with the use of a focused ion beam milling process and found to have thickness of a few microns. The thickness of this oxide layer was found to be related to the laser fluence parameter. As the fluence increased, the oxide layer thickness increased and the heat transfer performance decreased. For a specific test surface, the oxide layer was selectively removed by a chemical etching process. The removal of the oxide layer resulted in an enhancement in the HTC compared to the polished reference surface. Although the original FLSP copper surfaces were unable to outperform the polished reference curve, this experiment illustrates how an oxide layer can significantly affect heat transfer results and dominate other surface characteristics (such as increased surface area and wicking) that typically lead to heat transfer enhancement.
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Influence of Copper Oxide on Femtosecond Laser Surface Processed Copper Pool Boiling Heat Transfer Surfaces
Corey Kruse,
Corey Kruse
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Coreykruse_08@hotmail.com
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Coreykruse_08@hotmail.com
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Alfred Tsubaki,
Alfred Tsubaki
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: alfredtsubaki@gmail.com
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: alfredtsubaki@gmail.com
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Craig Zuhlke,
Craig Zuhlke
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: czuhlke@unl.edu
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: czuhlke@unl.edu
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Dennis Alexander,
Dennis Alexander
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: Dalexander1@unl.edu
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: Dalexander1@unl.edu
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Mark Anderson,
Mark Anderson
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: mark.anderson@huskers.unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: mark.anderson@huskers.unl.edu
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Edwin Peng,
Edwin Peng
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: edwin.peng@huskers.unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: edwin.peng@huskers.unl.edu
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Jeff Shield,
Jeff Shield
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: jshield@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: jshield@unl.edu
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Sidy Ndao,
Sidy Ndao
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Sndao2@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Sndao2@unl.edu
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George Gogos
George Gogos
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: ggogos@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: ggogos@unl.edu
1Corresponding author.
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Corey Kruse
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Coreykruse_08@hotmail.com
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Coreykruse_08@hotmail.com
Alfred Tsubaki
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: alfredtsubaki@gmail.com
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: alfredtsubaki@gmail.com
Craig Zuhlke
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: czuhlke@unl.edu
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: czuhlke@unl.edu
Dennis Alexander
Electrical and Computer Engineering,
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: Dalexander1@unl.edu
University of Nebraska—Lincoln,
N209 Scott Engineering Center,
Lincoln, NE 68588
e-mail: Dalexander1@unl.edu
Mark Anderson
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: mark.anderson@huskers.unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: mark.anderson@huskers.unl.edu
Edwin Peng
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: edwin.peng@huskers.unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: edwin.peng@huskers.unl.edu
Jeff Shield
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: jshield@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: jshield@unl.edu
Sidy Ndao
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Sndao2@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: Sndao2@unl.edu
George Gogos
Mechanical and Materials Engineering,
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: ggogos@unl.edu
University of Nebraska—Lincoln,
W342 Nebraska Hall,
Lincoln, NE 68588
e-mail: ggogos@unl.edu
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received August 15, 2018; final manuscript received March 7, 2019; published online March 27, 2019. Assoc. Editor: Milind A. Jog.
J. Heat Transfer. May 2019, 141(5): 051503 (9 pages)
Published Online: March 27, 2019
Article history
Received:
August 15, 2018
Revised:
March 7, 2019
Citation
Kruse, C., Tsubaki, A., Zuhlke, C., Alexander, D., Anderson, M., Peng, E., Shield, J., Ndao, S., and Gogos, G. (March 27, 2019). "Influence of Copper Oxide on Femtosecond Laser Surface Processed Copper Pool Boiling Heat Transfer Surfaces." ASME. J. Heat Transfer. May 2019; 141(5): 051503. https://doi.org/10.1115/1.4043129
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