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Keywords: whiskers (crystal)
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
Published Online: December 15, 2003
... . Manuscript received Oct. 2002. Associate Editor: E. Suhir. 01 Oct 2002 15 12 2003 tin copper stress analysis whiskers (crystal) substrates boundary-value problems surface mount technology integrated circuit packaging finite element analysis There are two major methods...
