1-8 of 8
Keywords: wetting
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
...K. N. Prabhu; G. Kumar The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
... resins self-assembly joining processes surface tension electronics packaging numerical analysis wetting In recent years, microsystem technologies that comprise microelectromechanical systems (MEMS) 1 , microoptoelectromechanical systems (MOEMS) 2 and optoelectronic multichip modules (OE...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
... and reflow. The final shape of the solder joint is a function of surface tension, wetting area, gravity, and applied forces. In this paper, a new methodology to simulate solder joint shape is presented. Large deformation viscoplastic finite element analysis is used to simulate incompressible fluid flow...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 22–25.
Published Online: April 30, 2004
... the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated. Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
Published Online: April 30, 2004
...L. L. Meekisho, Mem. ASME,; K. Nelson-Owusu, Mem. ASME, The final shape of a solidified solder fillet joint from a reflow process is determined by process parameters and the solder alloy’s physical properties, including surface tension, density, gravity, and wetting angles. This work investigates...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology PBGAs provide superior electrical performance, such as lower inductance and higher density of I/O...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 227–233.
Published Online: July 26, 2002
...D. Josell; W. E. Wallace; J. A. Warren; D. Wheeler; A. C. Powell, IV The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder joint dimensions, specifically stand...