...-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications. 11 02 2011 13 09 2011 15 09 2011 21 12 2011 21 12 2011...

... gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display (FPD), thanks to the merits of lighter, thinner, and miniaturation. COG is a common technique in the LCD packaging...

... analysis solders tin flip chip fine pitch high I/O density no-flow underfill void formation gas chromatography-mass spectrum chemical reaction Therefore, several studies were reviewed to explain the high volume of underfill voiding ( 5 8 ). These works can be divided into studies...

...Ming-Hwa R. Jen; Lee-Cheng Liu; Jenq-Dah Wu The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin ∕ Al – Ni V – Cu Under bump metallization (UBM) and packages of pure tin ∕ Al – Ni V – Cu UBM/substrate of standard thickness of aurum. The mechanical...

..., the sub-time-step method may improve the global computational efficiency significantly. In the following numerical examples, the focus is placed on the local computational efficiency in the user-defined subroutine. The user-specified factor n div is given 1. tin lead solders...

...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...