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Keywords: thermal management (packaging)
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
.... 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
... management challenges, and advanced 2D thermal management solutions are discussed. 04 06 2010 18 07 2011 09 12 2011 09 12 2011 integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal management through...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement With the rapid progress...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
Published Online: December 9, 2011
... 2011 09 12 2011 minimisation thermal management (packaging) thermal resistance Constructal theory is the view that the generation of flow configurations is a physics phenomenon that can be based on a physics principle (the Constructal law). According to this statement...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
... 2011 09 12 2011 09 12 2011 cooling heat exchangers oil drilling thermal management (packaging) thermoelectric devices Application of electronic devices for data acquisition during oil exploration helps mitigate risk factors associated with drilling operations [( 1 2 3 4...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
... 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
..., it is found that the effects of variation in substrate material properties are negligible. 04 05 2010 18 01 2011 23 06 2011 23 06 2011 bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
Published Online: June 17, 2011
... carbon nanotubes flexible electronics light emitting diodes thermal management (packaging) thin film transistors CNTs have quasi 1D structure with unique electrical, optical, mechanical, and thermal properties which make them very attractive for a wide range of applications [( 1...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... materials oxidation particle size polymers Raman spectroscopy scanning electron microscopy statistical analysis thermal conductivity thermal management (packaging) graphite nanoplatelet (GNP) thermal interface materials particle size polymer composites thermal properties...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number of benefits...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns in a typical raised floor data center. In this type of arrangement, the computer room air conditioning (CRAC) units push cold air into the plenum, from where it is introduced into the computer room...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011004.
Published Online: March 9, 2011
... of increasing temperature rise across the rack may be a better strategy than increasing inlet temperature to the rack. 07 04 2010 02 12 2010 09 03 2011 09 03 2011 cooling heat transfer network servers thermal management (packaging) ©2010 IEEE. Reprinted, with permission...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
... through the sides with relative error less than 10%. 22 02 2010 12 11 2010 03 03 2011 03 03 2011 computational fluid dynamics electronics packaging natural convection thermal analysis thermal management (packaging) DELPHI multisource DOTCOMP compact thermal model...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
... 2010 24 11 2010 diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance Heat dissipation in compact spaces with very high intensity is frequently encountered in the current designs of electronic devices. First...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
... processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED die shear die-attach material reliability Light emitting diode (LED) manufactured with p - n junction was first available in the 1960s. Compared with current...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
... scenarios, compared with a baseline design. 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
Published Online: June 25, 2010
... packaging microprocessor chips minimisation thermal management (packaging) In earlier microprocessor generations, the required instructions for the core processor were stored and channeled via the bus from the main memory. In contemporary generations, technology has made it practical to integrate...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global challenges because the demand for multitasking and faster computation is inversely proportional to the package size. This phenomenon has become...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...