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Keywords: thermal conductivity
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
Published Online: January 19, 2021
... for the military range might be adapted. To make it possible, new joining techniques are developed, one of them is use of pastes with silver nanoparticles sintered with low temperature joining technique. Silver sintered joints have three times higher thermal conductivity and five times lower electrical resistivity...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
... and thermal conductivity of substrate, on flow field and heat transfer characteristics. It is shown that due to radiative heat transfer, the wall temperatures are brought closer, and the trend of temperature variation along the top wall is significantly altered. Such effects are more pronounced for higher...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
... compounds palladium compounds photoacoustic effect silicon silver thermal conductivity welds As the size of electronic devices scales down and power densities increase, the demand for innovative cooling solutions becomes more imperative. Thermal interface materials (TIMs) such as thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
... conduction, material thermal conductivity and substrate thickness are investigated in detail. It is found that substrate axial conduction leads to a flatter bulk temperature profile along the channel, lower maximum temperature, and lower Nusselt number. The effect of substrate thickness on the conjugate heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
...Lin Hu; William Evans; Pawel Keblinski We present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
...Xiaobo Sun; Aiping Yu; Palanisamy Ramesh; Elena Bekyarova; Mikhail E. Itkis; Robert C. Haddon We report a 40% improvement of the thermal conductivity of graphite nanoplatelets–epoxy composites by chemical functionalization of graphite nanoplatelets utilizing nitric acid treatment, which also serves...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
.... Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures. 06 12 2009 18 02 2011 07 06 2011 07 06 2011 carbon nanotubes electronics packaging heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
Published Online: December 9, 2010
...Hung-En Chou; Shang-Ray Yang; Sea-Fue Wang; James C. Sung As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
... in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
...Jun Zeng; Renli Fu; Simeon Agathopoulos; Shaodong Zhang; Xiufeng Song; Hong He A finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, filler aspect ratio...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
Published Online: July 14, 2009
... for this application because it has moderate thermal conductivity and a low coefficient of thermal expansion, which is close to that of SiC. Materials that show promise for use as a diffusion barrier on Si 3 N 4 substrate for bonding SiC devices to a Si 3 N 4 substrate are refractory metals such as titanium (Ti...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
... anisotropic thermal conductivity of each region is then assigned as follows. All the regions are divided into smaller subregions whose size is below the pattern width. The thermal conductivity of each subregion is defined by the property of the material at the center of the subregion. Next, a thermal circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... for the flow and heat transfer in conjugate fluid/porous/solid domains. The results indicate that using unfinned blocks of porous aluminum results in low convective heat transfer due to the relatively low effective thermal conductivity of the porous aluminum. The addition of aluminum fins to the heat sink...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
Published Online: February 12, 2009
... provides specific information about the thermal path being influenced by the chimney. 25 04 2008 01 07 2008 12 02 2009 cooling natural convection semiconductor device packaging thermal conductivity thermal management (packaging) thermal resistance transistors The use...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... thickness. 10 03 2008 06 05 2008 11 02 2009 heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance optimized thickness rectangular plate orthotropic thermal conductivity analytical solution...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
..., and coolant flow rate. It was found that the high thermal conductivity copper of the direct bonded copper (DBC) layer is the most feasible location for the channels. Based on a new analytical heat transfer model developed for microchannels in IPEM structures, several design configurations were proposed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
Published Online: August 19, 2007
... surface energy thermal conductivity thermal diffusion film thermal conductivity pyroelectric coefficient measurement infrared sensor IRFPA One of the highest growth markets in the field of infrared imaging is for low-cost devices for use in firefighting, security, automotive...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
Published Online: April 4, 2007
...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
Published Online: December 19, 2006
... chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources. 28 08 2006 19 12 2006 conducting materials thermal conductivity thermal management (packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
Published Online: June 1, 2006
... . 21 04 2004 01 06 2006 thermal management (packaging) electronics packaging thermal conductivity waxes boron compounds phase change materials boron nitride paraffin wax phase change thermal interface thermal contact conductance pressure Heat dissipation...