... surface mount technology volume of fluid In the micro-electronics industry, the soldering of electronic components onto printed circuit boards (PCBs) is an extremely important process that allows establishing a reliable electronic assembly [ 1 , 2 ]. However, despite the great efforts made...

... measurement ceramic capacitors chip scale packaging crack detection failure analysis finite element analysis reliability surface mount technology system-in-package Multilayer ceramic chip capacitors are often used as integrated passives in, e.g., system in package (SIP) applications due...

... for further processing of experimental data. 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection modal analysis soldering solders surface mount technology Today’s electronic devices are compact, miniature, and high density, and surface mount technology is used...

... in providing the interconnection for surface mount technology (SMT) passives and leaded, bumped, or bumpless integrated circuit packages. The requirement for precise stencil printing was eliminated, as the application of magnetic field aligned the conductive columns in the Z -axis direction eliminating any...

...S. Chaparala; J. M. Pitarresi; S. Parupalli; S. Mandepudi; M. Meilunas One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). Currently, area array components...

.... Manuscript received June 29, 2003; revision received June 27, 2004. Review conducted by: B. Sammakia. 29 June 2003 27 June 2004 21 03 2005 integrated circuit packaging thermal management (packaging) surface mount technology flow simulation computational fluid dynamics shear...

... thermal management (packaging) ball grid arrays reliability solders integrated circuit packaging integrated circuit interconnections assembling failure analysis fault location surface mount technology Weibull distribution The thermal and mechanical reliability of surface mounted solder...

... October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount...

... micrographs of TABGA96 solder joint with voids (SAC) tin alloys silver alloys copper alloys durability thermomechanical treatment solders assembling viscoplasticity printed circuit testing surface mount technology finite element analysis Solder materials are extensively used...

... of Dust and Powder , 2nd. Edition , Plenum Press , New York, translated by R. K. Johnston, Consultants Bureau. assembling soldering integrated circuit manufacture surface mount technology ball grid arrays flip-chip devices Stencil Printing Fine Feature Solder Paste Release...

... of Electronic Systems ,” IEEE Trans. Compon. Packag. Technol. 1521-3331 , 25 ( 3 ), pp. 366 – 382 . 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount...

... ), pp. 71 – 78 . Primavera , A. A. , 2000 , “ The Influence of PCB Parameters on Assembly and Reliability ,” Advanced Packaging , pp. 29 – 52 . Prasad, R. P., 1997, Surface Mount Technology: Principles and Practice , Chapman & Hall. Haslehurst , L. , and Ekere , N. N...

... . Manuscript received Oct. 2002. Associate Editor: E. Suhir. 01 Oct 2002 15 12 2003 tin copper stress analysis whiskers (crystal) substrates boundary-value problems surface mount technology integrated circuit packaging finite element analysis There are two major methods...

...A. Tava´rez; J. E. Gonza´lez The development of a mathematical model of the soldering process of actual pastes as used in surface mount technology (SMT) lines is described in this paper. The coupled heat transfer processes between the solder paste and the flux including changes in solder paste...

... concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have...

... Profile Surface Mount Technology PBGAs provide superior electrical performance, such as lower inductance and higher density of I/O interconnections than QFPs for a given board real estate 1 2 . However, the industrialization of PBGA assembly on boards faces very new challenges when compared...

... and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives...

... 2000 01 May 2002 12 12 2002 adhesives surface mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers Electronic devices manufacturers are interested in research and development of new materials...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 surface mount technology printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning...

... fatigue life. surface mount technology integrated circuit packaging plastic packaging viscoelasticity elastic moduli shear modulus elastic deformation finite element analysis Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC...