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Keywords: substrates
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021005.
Published Online: April 25, 2008
... micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
...Yung-Shin Tseng; Tzu-Chen Hung; Bau-Shei Pei In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
Published Online: March 15, 2007
...Fang Liu; Guang Meng; Mei Zhao Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 125–129.
Published Online: October 11, 2005
... processes and, therefore, their microstructures as well as the practical difficulties in measuring small temperature gradients during the characterization. In this paper, we will report on a novel film on substrate technique that can be used conveniently for repeated measurements of the lateral thermal...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
... pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure environments...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
Published Online: December 15, 2003
...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
...Tapani M. Alander; Pekka A. Heino; Eero O. Ristolainen Electrically conductive substrates (i.e., metals) are often used in the mounting of semiconductor laser diodes. While metals offer a good electrical and thermal performance, they restrict the system integration due to lack of signal routing...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
... S have Tg (ca. 190°C) on the mid-range, which is near to the BT substrate Tg; types H have lower Tg, which is from 120 to 140°C. The basic data sheet and process parameter of mold compounds applied in CSP package P S H Resin type Multi-Functions Multi-Functions Biphenyl...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
Published Online: December 29, 1999
...Anh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation on SS substrates by laser drilling, dielectric...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
...Anh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and 12 in.×12 in. SS panel with laser drilled 0.01...