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Keywords: sensitivity analysis
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
... for each layer of the stator, especially the contact resistances between the impregnation, liner, laminations, and housing. Finally, a sensitivity analysis for each of the critical input parameters is provided. A maximum difference of 4%—for the highest temperature in the slot-winding and the end-winding...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... of the existing studies on electromigration. The simulation results for void generation and time to failure (TTF) are discussed and correlated with the previous test results. EM sensitivity analysis is also performed to investigate the effect of EM parameters and mechanical properties of material...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021009.
Published Online: April 2, 2009
... considered, the chiller energy use was the biggest fraction of about 41% and was also the most inefficient. The room air conditioning was the second largest energy component and was also the second most inefficient. A sensitivity analysis of plant and chiller energy efficiencies with chiller set point...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
... designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 397–406.
Published Online: December 21, 2004
... regression analysis thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 122–126.
Published Online: May 2, 2002
... moisture failure analysis stress analysis reflow soldering sensitivity analysis polymers 05 October 2000 02 05 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD October 5...