1-20 of 133
Keywords: reliability
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
... be detrimental to device reliability. Past studies have identified some failure mechanisms common to these devices. Examples of these failure mechanisms include fatigue, electromigration, stress induced voiding, corrosion, conduction filament formation, and time-dependent dielectric breakdown. While some review...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
Published Online: October 22, 2022
... was evaluated by both solder ball shear and die shear tests. A high temperature storage test and humidity test were carried out to evaluate the solder joint reliability. Experiment results showed that the Ag pad fabricated by AM is compatible with surface mount technology (SMT). Reliable solder joints on the Ag...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
Published Online: January 28, 2022
... wind under high-density current. Reducing the EM damage is extremely important to enhance the device reliability. With the progress in miniaturization of the metal nanoparticle ink lines, EM problem needs to be solved for ensuring the reliability of these lines. We know that the formation of aggregates...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
Published Online: January 19, 2021
...Xing Qiu; Jeffery C. C. Lo; Yuanjie Cheng; S. W. Ricky Lee; Yong Jhe Tseng; Peter Chiu Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021003.
Paper No: EP-20-1042
Published Online: August 27, 2020
...Alex Davila-Frias; Shah Limon; Val Marinov; Om Prakash Yadav Predicting the reliability is an important task of product life cycle analysis, especially during the product development stages. The uncertainty in the operating conditions and the presence of multistress factors makes this reliability...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
Published Online: August 7, 2020
...Pradeep Lall; Jinesh Narangaparambil; Ben Leever; Scott Miller Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance of flexible...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
Published Online: July 10, 2020
..., and bicep curls were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of the human body. In addition, reliability data has been gathered on test vehicles subjected to dynamic flexing. Continuous resistance data have been...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
Published Online: June 23, 2020
...Minghong Jian; Sinan Su; Sa'd Hamasha; Mohammad M. Hamasha; Atif Alkhazali The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
Published Online: April 24, 2020
... current has not been clarified. When electric devices are scaled down, current density and Joule heating increase in conductive lines and electromigration (EM) damage becomes a severe problem. Therefore, reducing the EM damage is extremely important to enhance the device reliability. In this study...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011009.
Paper No: EP-19-1058
Published Online: October 10, 2019
...Jinxin Liu; Zhiheng Huang; Paul P. Conway; Yang Liu Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal processing pose substantial reliability concerns in three-dimensional (3D) system integration. In this study, a phase-field-crystal (PFC) model is used...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
Published Online: May 24, 2019
...Mahsa Montazeri; Cody J. Marbut; David Huitink In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal conditions, is introduced...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...; published online May 17, 2019. Assoc. Editor: Tse Eric Wong. 18 12 2018 27 03 2019 solder joint fatigue reliability stress strain creep The electronic packaging industry is one of the largest industries in the world [ 1 ]. The role of solder in the electronic packaging has...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
Published Online: April 10, 2019
... center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
Published Online: April 10, 2019
... in ease of applications. Cost, performance, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and performance improvement of sintered silver using enhancement structures...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
... to guarantee that all BGA devices meet the acceptance requirement of relevant standards. Generally, a large number of samples should be measured to obtain a relatively reliable warpage data distribution in the reflow temperature range, which makes this test quite costly and extremely time consuming. This study...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
...Hamoon Azizsoltani; Achintya Haldar A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
Published Online: August 20, 2018
...Quang T. Su; Mohammad A. Gharaibeh; Aaron J. Stewart; James M. Pitarresi; Martin K. Anselm In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
....2018.2815344 [2] Croes , K. , Messemaeker , J. D. , Li , Y. , Guo , W. , Pedreira , O. V. , Cherman , V. , Stucchi , M. , Wolf , I. D. , and Beyne , E. , 2016 , “ Reliability Challenges Related to TSV Integration and 3D Stacking ,” IEEE Des. Test , 33 ( 3 ), pp. 37...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
Published Online: July 2, 2018
... heat sinks showed low thermal resistance, which was further reduced by double-sided cooling. Recent reliability results are presented, including high-temperature storage, temperature cycling, and power cycling. Contributed by the Electronic and Photonic Packaging Division of ASME for publication...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
.../micronano.2016.27 [5] Wu , K. C. , and Chiang , K. N. , 2016 , “ Characterization on Acceleration-Factor Equation for Packaging-Solder Joint Reliability ,” Microelectron. Reliab. , 65 , pp. 167 – 172 . 10.1016/j.microrel.2016.08.005 [6] Lee , C. H. , Wu , K. C...