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Keywords: packaging
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Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
Published Online: September 19, 2019
..., to achieve high-luminance lighting, the laser beam is usually focused onto the phosphor layer, which may easily increase the phosphor temperature to the thermal quenching region. A comprehensive understanding of these problems enables the advancements of packaging designs for WLDs. In this review, we...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
...Hsien-Cheng Tseng Advanced collector-up (C-up) heterojunction bipolar transistors (HBTs) with the thermal-via configuration (TVC) have been analyzed using a genetic algorithm (GA). Novel packaging structures are presented and evaluated in detail. With careful optimization, the thermal performance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041010.
Published Online: November 12, 2009
...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
...Lung-Tai Chen; Wood-Hi Cheng This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μ m photoresist block is placed just on the silicon membrane of the pressure sensor and removed after the molding...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021012.
Published Online: April 21, 2009
...Ji-Young Yoon; Ilho Kim; Soon-Bok Lee This study is to observe the exact behavior of anisotropic conductive adhesion (ACF) package under humid environments by obtaining the moisture-induced properties such as diffusion coefficient (the rate of moisture movement into the materials), saturated...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
... interconnections MIMIC printed circuits strip lines coplanar transmission lines coplanar waveguide coplanar strip lines flip-chip devices packaging Traditionally, wire bonding has been used in monolithic microwave integrated circuit (MMIC) packaging. With this technique, the operation...
Journal Articles
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
Published Online: November 13, 2008
... bifurcation boiling cooling packaging phase change materials The ever-growing demand for higher cooling capacity of cooling systems for electronics components has resulted in the advent of novel methods utilizing phase-change heat-transfer for massive heat removal ( 1 ). The actual cooling occurs...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
.... A numerical model for surface tension is outlined and validated with closed-form solutions. The results of the numerical model are compared to other known solder joint shape prediction methods. The effects of package weight, coplanarity, warpage, paste volume, pad misregistration, and joint construction...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
Published Online: July 8, 2004
...Liu Chen; Anders S. G. Andræ; Gang Zou; Johan Liu System-in-a-Package (SiP) aims to integrate the entire system functions within a system-level package containing multiple ICs and other components interconnected in a high-density substrate. A structure based on the SiP concept is proposed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
Published Online: December 15, 2003
...G. B. Dou; Y. C. Chan; Johan Liu In anisotropic conductive adhesive (ACA) interconnections, the particles are electrical conductors providing current paths in the fine pitch electronic packaging as well as physical parts connecting with the chip bumps and the substrate pads through the mechanical...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
Published Online: December 15, 2003
..., geometry, stress-optical coefficient, and birefringence of glass materials. The results presented herein should be useful for designing glass windows for shipping, storing, handling, functioning, and reliability. Contributed by the Electronic and Photonic Packaging Division for publication...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 512–519.
Published Online: December 15, 2003
...C. J. Liu; L. J. Ernst; G. Wisse; G. Q. Zhang; M. Vervoort Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
...L. J. Ernst; G. Q. Zhang; K. M. B. Jansen; H. J. L. Bressers For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding compounds are used for encapsulation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 325–328.
Published Online: September 17, 2003
... which rely on high precision optics, electronics and mechanics working in close concert, these emerging devices pose some unique packaging challenges yet to be addressed by the general packaging industry. Optical MEMS packages often are required to provide both optical and electrical access, hermeticity...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
Published Online: September 17, 2003
... general and more practical settings that are possibly applicable to a wide range of problems in microelectronics, optoelectronics, and microelectromechanical systems packaging. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 400–413.
Published Online: September 17, 2003
...Ji Eun Park; Iwona Jasiuk; Aleksander Zubelewicz Flip chip assemblies used in electronic packaging consist of three main components (layers): chip, underfill, and substrate. In this paper, the flip chip assembly is represented as a bi-material strip consisting of the chip and underfill. Our...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
Published Online: September 17, 2003
... provides flexibility in space reduction, weight savings, and excellent electrical functionality. In this article, the stacked die construction was built into the leaded package. It was found that the test vehicles had full delamination at the lead-frame paddle/mold compound interface after 100 temperature...
Journal Articles
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
Published Online: June 10, 2003
... of Mechanics (AAM), Society for Industrial and Applied Mathematics (SIAM), American Mathematical Society (AMS), International Electronics and Packaging Society (IEPS), Sigma Xi (MIT Branch), Canadian Applied Mathematics Society (CAMS), Canadian Society of Mechanical Engineers (CSME). For over 30 years...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 192–199.
Published Online: June 10, 2003
... an example where warped heat sources are in contact with a heat spreader. It is shown that, with decreasing heat spreader thickness, the warping of the heat source has an increasing influence on the contact resistance. Contributed by the Electronic and Photonic Packaging Division for publication...