1-2 of 2
Keywords: nanoparticles
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...