1-5 of 5
Keywords: molecular dynamics method
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures. 06 03 2010 16 02 2011 22 06 2011 22 06 2011 composite materials disperse systems molecular dynamics method Monte Carlo methods nanoparticles thermal...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
... molecular dynamics method nanoindentation nanotechnology Young's modulus modeling interface thermomechanical properties debonding nanoindentation test For nanoscale devices and structures, the interfacial phenomena often dominate their overall thermal behavior [( 1 )]. It is essential...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
Published Online: June 7, 2011
... carbon nanotubes molecular dynamics method carbon nanotubes molecular dynamics simulations unravelling atomistic simulations field emission Since 1991 [( 1 )] when carbon nanotubes were re-identified experimentally, they have attracted considerable curiosity to investigate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 35–40.
Published Online: March 14, 2006
... 2005 14 03 2006 electronics packaging molecular dynamics method reliability adhesion assembling delamination thermal cycling molecular dynamics cuprous oxide content interfacial adhesion Reliability under thermal cycling conditions is one of the main concerns...