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Keywords: microassembling
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
Published Online: June 16, 2009
... 19 09 2008 04 02 2009 16 06 2009 cracks delamination electronics packaging microassembling process capability analysis reliability statistical analysis die strength delamination good leadframe oxidized leadframe QFN package Two different mechanisms of copper...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
.... anisotropic conductive adhesive lead-free assembly thermal aging temperature-humidity aging Z bond adhesive conductive adhesives electronics packaging surface mount technology microassembling integrated circuit packaging ball grid arrays ageing contact resistance anisotropic media 04...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... to the outer rim, where they accumulate and coalesce to form big voids. 29 06 2004 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
....), Diffusion Phenomena in Thin Films and Microelectronic Materials , Noyes , Park Ridge, NJ, 1988 . 22 12 2003 15 09 2004 power electronics nanoelectronics flip-chip devices soldering electromigration current density microassembling reliability Flip Chip Solder Joint...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... . 12 01 2004 18 05 2004 lead alloys silver alloys tin alloys solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
Published Online: May 4, 2004
... element analysis fracture mechanics microassembling Integrated circuit packaging has been continuously driven to miniaturization. After circuits are built on the front side of a semiconductor wafer, the wafer is thinned before individual dies are cut off from the wafer. Backgrinding has been...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
Published Online: April 30, 2004
... adhesion deformation microassembling In the electronic packaging, die cracking, interface delamination, and package co-planarity are common structural failure phenomena encountered in manufacturing process or thermo-mechanical reliability evaluation. During the design or testing stage, stress...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 106–109.
Published Online: April 30, 2004
... the silicon and the carrier and separation of these materials by peeling. In a more complex package, a similar failure of adhesion at other material interfaces may arise instead. microassembling delamination integrated circuit packaging 01 January 2003 01 September 2003 30 04...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 597–601.
Published Online: December 15, 2003
... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
Published Online: September 17, 2003
... this technology to minimize package size and cost in a single package. Additionally, faster time to market and higher electrical functionality can be achieved in the same package size 1 2 . microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 105–111.
Published Online: October 20, 2000
... received at ASME Headquarters October 20, 2000. Associate Editor: R. Schmidt. 20 October 2000 space vehicle electronics planetary rovers microassembling integrated circuit reliability integrated circuit packaging cryogenic electronics soldering adhesives reviews Mars rovers...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...