... to and from the refrigerant. ( a ) Schematic and ( b ) actual setup of a miniature vapor compression heat pump microelectronics cooling solution [( 33 )] integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal...

... of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132 (2), p. 024501). 18 05 2010 25 05 2011 14 09 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric...

...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...

... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...

...) and operating at higher clock speed, higher Δ T can be realized. Based on this paper’s analysis, the optimized scenario resulted in a junction temperature of 56.6 ° C at the cost of a 14% performance loss. delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging...

... . 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global...

... 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book...

... coatings conductive adhesives copper integrated circuit packaging joining processes 2010 American Society of Mechanical Engineers ...

... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...

... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...

... circuit packaging microfabrication microsensors Taguchi methods glass cover chip CMOS image sensor Taguchi method packaging process Rapid technological advancements in the semiconductor field, combined with growing consumer demand for products with increasing levels of functionality...

... in package geometries. integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging industry primarily relies on the tried and trusted technique of imposing...

... approach moisture diffusion vapor pressure reflow chip scale package soft film cavitation unstable void growth wafer level film (WLF) cohesive failure die-attach desorption diffusion integrated circuit packaging moisture vapour pressure 18 09 2008 22 03 2009 31 07...

... released due to material cracking. direct concentration approach (DCA) moisture diffusion vapor pressure reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... ,” Int. J. Heat Mass Transfer 0017-9310 10.1016/S0017-9310(03)00044-9 , 46 ( 15 ), pp. 2737 – 2753 . 25 08 2008 22 12 2008 03 04 2009 computational fluid dynamics heat sinks integrated circuit packaging micropumps thermal management (packaging) hot spots liquid...

... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...

... the equations for various surfaces to calculate the maximum junction temperature for a given multilayer body. Finally validation of the analytical solution is carried out using previously developed numerical model. 18 11 2007 15 05 2008 12 02 2009 integrated circuit packaging integrated...

... analytical solution spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 2009 American Society of Mechanical Engineers ...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...