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Keywords: hot spots
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
...Craig Green; Andrei G. Fedorov; Yogendra K. Joshi An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate unmixed fluids to meet the cooling...
