... electronics cooling manifold heat sink thermal resistance numerical simulation National Science Foundation 10.13039/100000001 NSF IUCRC Award No. IIP-1738793 and MRI Award No. CNS1040666. Digital data from various regions of the internet, like social media networks, blogs, e-commerce...

... e-mail:  chady.al.sayed@usherbrooke.ca e-mail:  luc.frechette@usherbrooke.ca e-mail:  julien.sylvestre@usherbrooke.ca 05 07 2021 12 12 2021 28 01 2022 integrated heat spreader liquid immersion cooling boiling electronics cooling simulation Emerging...

.... A. , Ikhlaq , M. , and Arik , M. , 2016 , “ An Investigation Into Flow and Heat Transfer of an Ultrasonic Micro-Blower Device for Electronics Cooling Applications ,” Appl. Therm. Eng. , 106 , pp. 881 – 889 . 10.1016/j.applthermaleng.2016.06.094 [9] Ghaffari , O. , Ikhlaq , M...

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.... , Cheng , C. H. , Wang , J. C. , and Chen , S. L. , 2008 , “ Heat Pipe for Cooling of Electronic Equipment ,” Energy Convers. Manage. , 49 ( 11 ), pp. 3398 – 3404 . 10.1016/j.enconman.2008.05.002 [3] Wang , J. , 2011 , “ L-Type Heat Pipes Application in Electronic Cooling System...

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