1-15 of 15
Keywords: composite materials
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
.... Assoc. Editor: Jeffrey C. Suhling. 31 07 2017 02 08 2018 BGA BT Composite materials PBGA Reliability SMT Thermal analysis Warpage behavior is an important thermal–mechanical characteristic of ball grid array (BGA) devices [ 1 , 2 ]. The mechanism of BGA device warpage...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... corner of the map with both high k and low R . Commercial TIMs such as conventional polymeric TIMs, including thermal greases, thermal pads, polymeric composite materials, etc., span a wide range of R in the lower k regimes, typically < 10 W/mK, whereas the high-performing solder TIMs have k...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role in removing waste heat from the chip...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
...: Kaushik Mysore. 22 09 2017 19 12 2017 Composite materials Electronic PWB Design Thermal analysis The revolutionary field of electromagnetic metamaterials [ 1 – 3 ] served as a foundation for the field of thermal metamaterials, which has grown significantly within the last...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
... January 25, 2017; final manuscript received September 24, 2017; published online October 13, 2017. Assoc. Editor: Kaushik Mysore. 25 01 2017 24 09 2017 Area array BGA Composite materials SMT Underfill In recent years, ball grid array (BGA) packages have been widely used...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031006.
Paper No: EP-17-1016
Published Online: June 30, 2017
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 11, 2017; final manuscript received April 19, 2017; published online June 30, 2017. Assoc. Editor: Yi-Shao Lai. 11 02 2017 19 04 2017 Bio-Research Composite materials Dielectrics Epoxy resin...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... modes of SMT components with different resonant frequencies. Composite materials COTS Failure analysis FR-4 Harsh environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT 26 09 2015 01 03 2017 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2017, 139(2): 020801.
Paper No: EP-16-1131
Published Online: June 13, 2017
... . Manuscript received December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo. 01 12 2016 22 02 2017 Composite materials Electronic Flexible circuits Nanotechnolgy In the course of evolution, structures...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
Published Online: October 21, 2016
... contacts between the filler particles in the composite material. The quasi-areal contacts are formed from nanoparticles self-assembled by capillary bridging, so-called necks. Thermal conductivities of up to 2.5 W/m K and 2.8 W/m K were demonstrated experimentally for the percolating and the neck-based...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
Published Online: June 8, 2016
... micromechanics theories used in composite materials. The Sn dendrite lobes were assumed to be spherical-shaped inclusions (with effective isotropic properties) and were hence accounted for only through their volume fractions in Eshelby's tensor. Although the model proposed by Cuddalorepatta and Dasgupta [ 88...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 06 01 2016 Composite materials COTS FR-4 Harsh environment MEMS...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. 04 03 2009 14 08 2009 21 10 2009 composite materials electronics packaging finite element analysis polymers thermal conductivity composite materials...