... . Manuscript received Oct. 2002. Associate Editor: E. Suhir. 01 Oct 2002 15 12 2003 tin copper stress analysis whiskers (crystal) substrates boundary-value problems surface mount technology integrated circuit packaging finite element analysis There are two major methods...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... rigid indenters onto elastic layers for two cases: a spherical punch and a flat-ended circular punch. Chen and Engel 10 developed a general approximate method for the axisymmetric mixed boundary value problem for determining the contact radius for a sphere/multilayer media. The numerical results were...

... bending packaging finite element analysis boundary-value problems elliptic equations printed circuits In a number of emerging technical areas, there is a new need to bend thin plates (beams) into various shapes. For example, optical fibers are used in various communication cables. To have...

.... Kelman , R. B. , 1979 , “ Least Squares Fourier Series Solutions To Boundary Value Problems ,” SIAM Rev. , 21 , No. 3. Sullhan, R., Fredholm, M., Monaghan, T., Agarwall, A., and Kozarek, B., 1991, “Thermal Modeling and Analysis of Pin Grid Arrays and Multichip Modules,” Proceedings of the 7th...