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Keywords: Monte Carlo methods
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures. 06 03 2010 16 02 2011 22 06 2011 22 06 2011 composite materials disperse systems molecular dynamics method Monte Carlo methods nanoparticles thermal...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
Published Online: March 14, 2003
... fracture toughness integrated circuit reliability integrated circuit packaging Monte Carlo methods silicon Strength Reliability Silicon Grinding Defects Dicing Defects Underfill is used in flip chips with organic substrates to reduce the shear on the solder balls and consequent...