... are subjected to thermal processing [ 13 – 15 ]. Protrusion causes damage to the back-end-of-line layers, which results in the failure of 3D packaging; therefore, this phenomenon poses a substantial reliability issue that must be solved. 3D packaging micro vias reliability 19 05 2019 14...

... ]. The orthogonal metal lines are arranged at two different metal layers and connected by micro-vias at the cross points. Power wires and ground wires are routed alternately with an identical pitch as in Fig. 2 . In this paper, we consider the power mesh with an area of 400 μ m × 400 μ m. The model of on-chip...

... and Future Directions in MEMS ,” Exp. Mech. , 52 ( 3 ), pp. 289 – 303 . 10.1007/s11340-011-9520-1 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB Electronics and microelectromechanical systems (MEMS) packaging refers to the housing of integrated circuits (IC...

... . Manuscript received June 14, 2016; final manuscript received October 25, 2016; published online November 10, 2016. Assoc. Editor: Mehdi Asheghi. 14 06 2016 25 10 2016 Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis Gallium nitride (GaN) based...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2015; final manuscript received March 14, 2016; published online April 25, 2016. Assoc. Editor: Mehdi Asheghi. 14 09 2015 14 03 2016 3D packaging Micro vias Improvements in high-performance two...

... of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond The Electronics Industry has...