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Keywords: Electronic
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044501.
Paper No: EP-18-1013
Published Online: August 3, 2018
...Richard C. Jaeger; Jeffrey C. Suhling; Jun Chen The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136 (4), p. 041014; Jaeger, R. C...
Topics: Sensors, Stress
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
...Ž. Staliulionis; H. Conseil-Gudla; S. Mohanty; M. Jabbari; R. Ambat; J. H. Hattel The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
... Corporation, 1 Space Park, Redondo Beach, CA 90278. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received January 9, 2018; final manuscript received April 12, 2018; published online May 9, 2018. Assoc. Editor...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
Published Online: May 9, 2018
... , 5 ]. The notion of cooling electronic systems using liquids is not novel; however, potential leaks and the capital cost have greatly restricted its application in real data centers [ 6 – 8 ]. Table 1 Specs of the servers in the DLC rack Server Processor Quantity Type Dell...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
Published Online: May 9, 2018
... joint. The Auger electron spectroscopy (AES) surface and depth profile techniques identified surface and through-thickness contaminants in the Au metallization layer. In one case, the AES analysis identified background levels of carbon (C) contamination on the surface; however, the depth profile...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...
Journal Articles
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
Published Online: March 2, 2018
...Richard C. Jaeger; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling 16 10 2017 11 12 2017 Electronic Sensors Fig. 1 Analysis by superposition: ( a ) diagonal current excitation; ( b ) and ( c ) equivalent circuits for superposition Unfortunately...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
...Nicolas Lamaison; Raffaele L. Amalfi; Todd Salamon; Jackson B. Marcinichen; John R. Thome Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
...Ercan M. Dede; Feng Zhou; Paul Schmalenberg; Tsuyoshi Nomura Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
...Sven Rzepka; Alexander Otto; Dietmar Vogel; Rainer Dudek The revolutionary changes in automotive industry toward fully connected automated electrical vehicles necessitate developments in automotive electronics at unprecedented speed. Signal, control, and power electronics will heterogeneously...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
... Nemati for their support. The National Science Foundation Industry/University Cooperative Research Center on Energy Smart Electronic Systems (ES2). References [1] Patel , C. D. , Bash , C. E. , Sharma , R. K. , Beitelmal , A. , and Friedrich , R. J. , 2003...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
Published Online: October 27, 2017
..., the overall system cost may be reduced. Table 6 compares the relative individual unit costs and relative cost per rack for 60 mm, 80 mm, and 120 mm fans used in this study. Prices were taken from online electronics component distributor. The results here are not exhaustive of all possible fans that may...
Topics: Fans, Temperature
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
Published Online: October 27, 2017
... is investigated. Each rack-level setup has distinct advantages. Selecting between configurations would necessitate a compromise between efficiency, redundancy, and cost. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041005.
Paper No: EP-17-1020
Published Online: September 7, 2017
... of electronic equipment offers a singular cooling solution in which the entirety of a server may be cooled by a single medium. This may provide simplicity and ease in planning and implementation of a total solution. A legacy approach to full liquid immersion cooling is using dielectric fluorocarbon refrigerants...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
...Rajiv L. Iyer; Daryl L. Santos Over the past ten years, there has been an exponential growth in innovations and designs to offer cutting edge electronic devices that are smaller, faster, with advanced features built in. The existence of smartphones, wearable devices, tablets, etc., is the evidence...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
Published Online: July 10, 2017
... direction. In the experiments, the transition occurs downstream than the calculated location, since the superheated conditions have to be reached. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
Published Online: June 14, 2017
...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...
Topics: Lasers, Packaging
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2017, 139(2): 020801.
Paper No: EP-16-1131
Published Online: June 13, 2017
...Yuyan Gao; Huanyu Cheng Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
Published Online: April 24, 2017
... at temperatures up to 260 °C, which is the typical maximum temperature experienced by electronic packages during solder reflow. For the epoxy underfills tested in this study, the DCB samples failed cohesively within the underfill at room temperature but started failing adhesively at temperatures near 150 °C...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
... energy by allowing IT equipment to operate outside the currently recommended and allowable ASHRAE envelopes and outside the ISA severity level G1. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P...