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Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska

J. Electron. Packag. September 2021, 143(3): 034501.

Paper No: EP-20-1091

DOI: https://doi.org/10.1115/1.4049240

Published Online: January 19, 2021

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Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature

Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng

J. Electron. Packag. March 2021, 143(1): 014501.

Paper No: EP-19-1083

DOI: https://doi.org/10.1115/1.4046755

Published Online: June 4, 2020

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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water

Journal Articles

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Oluwaseun Awe, Jimil M. Shah, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler

J. Electron. Packag. June 2020, 142(2): 024501.

Paper No: EP-19-1015

DOI: https://doi.org/10.1115/1.4046556

Published Online: April 6, 2020

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Topics: Corrosion, Data centers, Temperature, Contamination, Failure, Reliability

Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen

J. Electron. Packag. December 2018, 140(4): 044502.

Paper No: EP-18-1015

DOI: https://doi.org/10.1115/1.4040794

Published Online: August 6, 2018

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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices

Journal Articles

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Richard C. Jaeger, Jeffrey C. Suhling, Jun Chen

J. Electron. Packag. December 2018, 140(4): 044501.

Paper No: EP-18-1013

DOI: https://doi.org/10.1115/1.4040829

Published Online: August 3, 2018

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Topics: Sensors, Stress

Journal Articles

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Ben-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng

J. Electron. Packag. June 2016, 138(2): 024501.

Paper No: EP-15-1073

DOI: https://doi.org/10.1115/1.4032932

Published Online: March 23, 2016

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Topics: Failure, Packaging, Reliability, Silicon

Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin

J. Electron. Packag. December 2015, 137(4): 044501.

Paper No: EP-15-1062

DOI: https://doi.org/10.1115/1.4031750

Published Online: October 20, 2015

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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation

Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi

J. Electron. Packag. March 2015, 137(1): 014501.

Paper No: EP-13-1116

DOI: https://doi.org/10.1115/1.4027992

Published Online: October 6, 2014

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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress

Journal Articles

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

J. H. L. Ling, A. A. O. Tay

J. Electron. Packag. March 2015, 137(1): 014502.

Paper No: EP-13-1133

DOI: https://doi.org/10.1115/1.4028120

Published Online: October 6, 2014

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Topics: Temperature, Temperature distribution, Finite element analysis, Junctions, Heat

Journal Articles

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju

J. Electron. Packag. December 2014, 136(4): 044501.

Paper No: EP-13-1132

DOI: https://doi.org/10.1115/1.4028316

Published Online: September 19, 2014

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Topics: Aluminum, Bonding, Manufacturing, Nanowires, Fasteners, Electrical resistance

Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu

J. Electron. Packag. September 2014, 136(3): 034502.

Paper No: EP-13-1099

DOI: https://doi.org/10.1115/1.4027379

Published Online: May 12, 2014

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Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films

Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park

J. Electron. Packag. September 2014, 136(3): 034501.

Paper No: EP-13-1094

DOI: https://doi.org/10.1115/1.4026661

Published Online: May 5, 2014

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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties

Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie

J. Electron. Packag. June 2014, 136(2): 024501.

Paper No: EP-13-1058

DOI: https://doi.org/10.1115/1.4026538

Published Online: April 29, 2014

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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution

Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. September 2007, 129(3): 366–370.

DOI: https://doi.org/10.1115/1.2753988

Published Online: September 12, 2006

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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature

Journal Articles

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Marc Hodes, Cristian Bolle, Paul Kolodner

J. Electron. Packag. June 2007, 129(2): 216–218.

DOI: https://doi.org/10.1115/1.2721095

Published Online: September 5, 2006

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Topics: Circuits, Cooling, Gaskets, Heat sinks, Fins, Electromagnetic interference, Stress, Air flow, Flow (Dynamics)

Journal Articles

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang

J. Electron. Packag. March 2007, 129(1): 105–108.

DOI: https://doi.org/10.1115/1.2429717

Published Online: June 6, 2006

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Topics: Reliability, Semiconductor wafers, Solder joints, Transient analysis

Journal Articles

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia

J. Electron. Packag. March 2006, 128(1): 92–97.

DOI: https://doi.org/10.1115/1.2161231

Published Online: May 10, 2005

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Topics: Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Thermal management

Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

J. Electron. Packag. December 2004, 126(4): 560–564.

DOI: https://doi.org/10.1115/1.1827271

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis

Journal Articles

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

X. K. Sun, X. J. Xin, Z. J. Pei

J. Electron. Packag. June 2005, 127(2): 189–192.

DOI: https://doi.org/10.1115/1.1869510

Published Online: May 4, 2004

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Topics: Finite element analysis, Semiconductor wafers, Stress, Testing, Fracture (Materials)

Journal Articles

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

Ismail Fidan

J. Electron. Packag. March 2004, 126(1): 173–176.

DOI: https://doi.org/10.1115/1.1646422

Published Online: April 30, 2004

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Topics: Electronics, Lasers, Manufacturing, Printed circuit board assemblies, Reliability, Soldering, Solders, Computer-aided engineering, Production planning, Solder joints

Journal citation

NARROW

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

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