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Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Article titled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
https://doi.org/10.1115/1.4034369
Published Online: August 19, 2016
View Article titled, Modular Microfluidic Filters Based on Transparent Membranes
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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles
Journal Articles

Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

H. Chai, Y. Zohar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 137–142.
https://doi.org/10.1115/1.2792675
Published Online: September 1, 1999
View Article titled, Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
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Topics: Steady state, Transfer molding, Wire, Cavities, Density, Failure, Fluid dynamics, Transparency, Vehicles, Vents
Journal Articles

Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems

Issam Mudawar, Peter E. Jimenez, Robert E. Morgan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 116–125.
https://doi.org/10.1115/1.2905499
Published Online: June 1, 1994
View Article titled, Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems
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Topics: Aluminum, Blocks (Building materials), Boiling, Cavities, Condensed matter, Coolants, Cooling, Energy dissipation, Flow (Dynamics), Hardware
Journal Articles

Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium

T. Nowak, R. J. Pryputniewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 71–80.
https://doi.org/10.1115/1.2905444
Published Online: March 1, 1992
View Article titled, Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
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Topics: Drilling, Lasers, Transparency, Laser beams, Shapes, Computer simulation, Errors, Experimental analysis, Geometry, Temperature