Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 48

2 3

Sort by

Sort Order Select

Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon

J. Electron. Packag. September 2012, 134(3): 031010.

DOI: https://doi.org/10.1115/1.4007118

Published Online: July 23, 2012

View Article

Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing

Journal Articles

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia

J. Electron. Packag. March 2012, 134(1): 011007.

DOI: https://doi.org/10.1115/1.4005911

Published Online: March 19, 2012

View Article

Topics: Epoxy adhesives, Epoxy resins, Temperature, Temperature effects, Stress analysis (Engineering)

Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han

J. Electron. Packag. June 2008, 130(2): 024502.

DOI: https://doi.org/10.1115/1.2912181

Published Online: May 14, 2008

View Article

Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion

Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee

J. Electron. Packag. June 2005, 127(2): 164–171.

DOI: https://doi.org/10.1115/1.1870016

Published Online: June 8, 2004

View Article

Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design

Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim

J. Electron. Packag. December 2003, 125(4): 569–575.

DOI: https://doi.org/10.1115/1.1604803

Published Online: December 15, 2003

View Article

Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)

Journal Articles

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan

J. Electron. Packag. December 2003, 125(4): 621–624.

DOI: https://doi.org/10.1115/1.1604805

Published Online: December 15, 2003

View Article

Topics: Boundary-value problems, Compressive stress, Copper, Finite element analysis, Stress, Stress analysis (Engineering), Tin, Chemical reactions, Displacement, Materials properties

Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director

J. Electron. Packag. March 2003, 125(1): 134–138.

DOI: https://doi.org/10.1115/1.1535446

Published Online: March 14, 2003

View Article

Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics

Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng

J. Electron. Packag. March 2003, 125(1): 4–17.

DOI: https://doi.org/10.1115/1.1512295

Published Online: March 14, 2003

View Article

Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems

Journal Articles

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young

J. Electron. Packag. September 2002, 124(3): 266–270.

DOI: https://doi.org/10.1115/1.1477192

Published Online: July 26, 2002

View Article

Topics: Ball-Grid-Array packages, Cycles, Durability, Failure, Modeling, Solder joints, Solders, Stress, Stress analysis (Engineering), Thermomechanics

Journal Articles

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Xiaoling He, Robert E. Fulton, Fellow ASME Professor

J. Electron. Packag. June 2002, 124(2): 77–84.

DOI: https://doi.org/10.1115/1.1457454

Published Online: May 2, 2002

View Article

Topics: Deflection, Laminates, Printed circuit boards, Stress, Nonlinear dynamics, Stress analysis (Engineering), Deformation, Equations of motion, Resonance

Journal Articles

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume

J. Electron. Packag. March 2002, 124(1): 45–53.

DOI: https://doi.org/10.1115/1.1401737

Published Online: January 1, 2001

View Article

Topics: Cooling, Corners (Structural elements), Finite element analysis, Printed circuit boards, Stress, Stress analysis (Engineering), Temperature, Transients (Dynamics), Wave soldering, Copper

Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Krishna Darbha, Abhijit Dasgupta, Professor

J. Electron. Packag. June 2001, 123(2): 147–155.

DOI: https://doi.org/10.1115/1.1328745

Published Online: October 10, 2000

View Article

Topics: Ball-Grid-Array packaging, Creep, Finite element analysis, Flip-chip devices, Manufacturing, Solders, Stress, Stress analysis (Engineering), Durability, Temperature

Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor

J. Electron. Packag. June 2001, 123(2): 141–146.

DOI: https://doi.org/10.1115/1.1328744

Published Online: October 10, 2000

View Article

Topics: Displacement, Finite element analysis, Potential energy, Stress, Stress analysis (Engineering), Creep, Thermomechanics, Electronic products

Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon

J. Electron. Packag. March 2001, 123(1): 6–15.

DOI: https://doi.org/10.1115/1.1326437

Published Online: July 1, 2000

View Article

Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass

Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

K. Darbha, J. H. Okura, A. Dasgupta

J. Electron. Packag. December 1999, 121(4): 231–236.

DOI: https://doi.org/10.1115/1.2793845

Published Online: December 1, 1999

View Article

Topics: Durability, Flip-chip devices, Solders, Thermomechanics, Flip-chip, Damage, Stress, Stress analysis (Engineering), Finite element model, Modeling

Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers

J. Electron. Packag. December 1999, 121(4): 237–241.

DOI: https://doi.org/10.1115/1.2793846

Published Online: December 1, 1999

View Article

Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles

Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee

J. Electron. Packag. September 1999, 121(3): 148–155.

DOI: https://doi.org/10.1115/1.2792677

Published Online: September 1, 1999

View Article

Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes

Journal Articles

Stress Analysis of Thermal Inclusions With Interior Voids and Cracks

C. Q. Ru

J. Electron. Packag. September 2000, 122(3): 192–199.

DOI: https://doi.org/10.1115/1.1286020

Published Online: August 30, 1999

View Article

Topics: Fracture (Materials), Stress, Stress analysis (Engineering), Thermal stresses

Journal Articles

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

L. Maciucescu, T.-L. Sham, E. Krempl

J. Electron. Packag. June 1999, 121(2): 92–98.

DOI: https://doi.org/10.1115/1.2792673

Published Online: June 1, 1999

View Article

Topics: Alloys, Deformation, Modeling, Solders, Tin, Viscoplasticity, Accounting, Creep, Solder joints, Stress analysis (Engineering)

Journal Articles

Tools for Stress Analysis of Microelectronic Structures

Boris Mirman

J. Electron. Packag. September 2000, 122(3): 280–282.

DOI: https://doi.org/10.1115/1.1286104

Published Online: December 11, 1998

View Article

Topics: Stress analysis (Engineering)

2 3

Journal citation

NARROW

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Hygrothermal Cracking Analysis of Plastic IC Package

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Thermomechanical Durability of High I/O BGA Packages

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Stress Analysis of Thermal Inclusions With Interior Voids and Cracks

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

Tools for Stress Analysis of Microelectronic Structures

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only