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Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu

J. Electron. Packag. March 2023, 145(1): 011103.

Paper No: EP-22-1013

DOI: https://doi.org/10.1115/1.4055840

Published Online: October 22, 2022

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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints

Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007.

Paper No: EP-22-1044

DOI: https://doi.org/10.1115/1.4055318

Published Online: September 28, 2022

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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life

Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119.

Paper No: EP-21-1057

DOI: https://doi.org/10.1115/1.4054131

Published Online: April 22, 2022

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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature

Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021117.

Paper No: EP-21-1066

DOI: https://doi.org/10.1115/1.4053766

Published Online: March 11, 2022

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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver

Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. December 2022, 144(4): 041010.

Paper No: EP-21-1030

DOI: https://doi.org/10.1115/1.4053309

Published Online: January 28, 2022

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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis

Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi

J. Electron. Packag. September 2022, 144(3): 031001.

Paper No: EP-20-1111

DOI: https://doi.org/10.1115/1.4051620

Published Online: September 15, 2021

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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)

Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker

J. Electron. Packag. September 2022, 144(3): 031006.

Paper No: EP-21-1025

DOI: https://doi.org/10.1115/1.4051647

Published Online: September 15, 2021

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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041003.

Paper No: EP-20-1001

DOI: https://doi.org/10.1115/1.4048535

Published Online: October 12, 2020

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Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing

Journal Articles

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

J. Electron. Packag. December 2020, 142(4): 041001.

Paper No: EP-20-1010

DOI: https://doi.org/10.1115/1.4048109

Published Online: August 27, 2020

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Topics: Fatigue life, Shear (Mechanics), Stress, Fatigue, Solder joints, Cycles, Fatigue testing, Solders

Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

J. Electron. Packag. September 2020, 142(3): 031121.

Paper No: EP-20-1008

DOI: https://doi.org/10.1115/1.4047844

Published Online: August 7, 2020

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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing

Journal Articles

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen

J. Electron. Packag. March 2021, 143(1): 011004.

Paper No: EP-19-1095

DOI: https://doi.org/10.1115/1.4047338

Published Online: June 4, 2020

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Topics: Adhesion, Copper, Flux (Metallurgy), Shear (Mechanics)

Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

J. Electron. Packag. March 2020, 142(1): 011009.

Paper No: EP-19-1058

DOI: https://doi.org/10.1115/1.4044648

Published Online: October 10, 2019

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Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper

Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Journal Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar

J. Electron. Packag. March 2019, 141(1): 010804.

Paper No: EP-18-1086

DOI: https://doi.org/10.1115/1.4042805

Published Online: March 13, 2019

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Topics: Adhesion, Compression, Shear (Mechanics), Temperature, Thermal expansion, Stress, Thermomechanics, Silicon

Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel

J. Electron. Packag. June 2019, 141(2): 021002.

Paper No: EP-17-1123

DOI: https://doi.org/10.1115/1.4042806

Published Online: March 1, 2019

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Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)

Journal Articles

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Lei Wang, Jun Wang, Fei Xiao

J. Electron. Packag. March 2019, 141(1): 011003.

Paper No: EP-18-1037

DOI: https://doi.org/10.1115/1.4041714

Published Online: February 25, 2019

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Topics: Columns (Structural), Copper, Shear (Mechanics), Stress, Failure, Finite element analysis, Failure mechanisms

Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906.

Paper No: EP-17-1101

DOI: https://doi.org/10.1115/1.4039027

Published Online: March 2, 2018

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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing

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Journal citation

NARROW

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

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