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Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

J. Electron. Packag. September 2019, 141(3): 031010.

Paper No: EP-18-1096

DOI: https://doi.org/10.1115/1.4043479

Published Online: May 24, 2019

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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering

Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang

J. Electron. Packag. June 2015, 137(2): 021013.

Paper No: EP-13-1015

DOI: https://doi.org/10.1115/1.4029569

Published Online: June 1, 2015

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Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering

Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang

J. Electron. Packag. June 2009, 131(2): 021004.

DOI: https://doi.org/10.1115/1.3103932

Published Online: April 1, 2009

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Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering

Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan

J. Electron. Packag. June 2005, 127(2): 113–119.

DOI: https://doi.org/10.1115/1.1849236

Published Online: June 3, 2005

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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing

Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee

J. Electron. Packag. June 2005, 127(2): 164–171.

DOI: https://doi.org/10.1115/1.1870016

Published Online: June 8, 2004

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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design

Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton

J. Electron. Packag. June 2005, 127(2): 120–126.

DOI: https://doi.org/10.1115/1.1876472

Published Online: May 18, 2004

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Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability

Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato

J. Electron. Packag. March 2003, 125(1): 31–38.

DOI: https://doi.org/10.1115/1.1525244

Published Online: March 14, 2003

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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods

Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya

J. Electron. Packag. December 2002, 124(4): 323–327.

DOI: https://doi.org/10.1115/1.1501304

Published Online: December 12, 2002

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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination

Journal Articles

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E. H. Wong, R. Rajoo, S. W. Koh, T. B. Lim

J. Electron. Packag. June 2002, 124(2): 122–126.

DOI: https://doi.org/10.1115/1.1461367

Published Online: May 2, 2002

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Topics: Flip-chip devices, Modeling, Packaging, Reflow soldering, Stress, Electronic packaging, Thermal stresses, Diffusion (Physics), Wire, Failure

Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume

J. Electron. Packag. December 1999, 121(4): 263–270.

DOI: https://doi.org/10.1115/1.2793850

Published Online: December 1, 1999

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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)

Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee

J. Electron. Packag. September 1999, 121(3): 148–155.

DOI: https://doi.org/10.1115/1.2792677

Published Online: September 1, 1999

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Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes

Journal Articles

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

Kuo-Ning Chiang, Associate Professor,, Chang-Ming Liu, Graduate Assistant,

J. Electron. Packag. June 2001, 123(2): 127–131.

DOI: https://doi.org/10.1115/1.1339196

Published Online: August 19, 1999

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Topics: Reliability, Shapes, Solders, Thermal stresses, Ball-Grid-Array packaging, Geometry, Reflow soldering, Finite element analysis, Design

Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt

J. Electron. Packag. June 1998, 120(2): 141–144.

DOI: https://doi.org/10.1115/1.2792601

Published Online: June 1, 1998

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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Journal Articles

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

M. R. Stiteler, I. C. Ume

J. Electron. Packag. March 1997, 119(1): 1–7.

DOI: https://doi.org/10.1115/1.2792196

Published Online: March 1, 1997

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Topics: Printed circuit boards, Warping, Reflow soldering, Measurement systems, Shades and shadows, Soldering, Vehicles

Journal Articles

Experimental Investigation of the Formation of Surface Mount Solder Joints

P. P. Conway, M. R. Kalantary, D. J. Williams

J. Electron. Packag. December 1996, 118(4): 223–228.

DOI: https://doi.org/10.1115/1.2792156

Published Online: December 1, 1996

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Topics: Solder joints, Surface mount packaging, Solders, Computers, Manufacturing, Microscopy, Process design, Reflow soldering, Temperature, Wetting

Journal Articles

Ball Grid Array Thermomechanical Response During Reflow Assembly

T. E. Voth, T. L. Bergman

J. Electron. Packag. December 1996, 118(4): 214–222.

DOI: https://doi.org/10.1115/1.2792155

Published Online: December 1, 1996

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Topics: Ball-Grid-Array packaging, Manufacturing, Thermomechanics, Computer simulation, Reflow soldering, Soldering, Thermal conductivity

Journal Articles

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Caroline S. Lee, Doug C. Crafts, T. W. Eagar

J. Electron. Packag. December 1995, 117(4): 281–287.

DOI: https://doi.org/10.1115/1.2792106

Published Online: December 1, 1995

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Topics: Solders, Tin, Etching, Corrosion, Diffusion (Physics), Electroplating, Metallurgy, Reflow soldering, Sulfur, Water

Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun

J. Electron. Packag. December 1995, 117(4): 317–322.

DOI: https://doi.org/10.1115/1.2792111

Published Online: December 1, 1995

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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating

Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby

J. Electron. Packag. September 1995, 117(3): 230–234.

DOI: https://doi.org/10.1115/1.2792097

Published Online: September 1, 1995

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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology

Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan

J. Electron. Packag. June 1995, 117(2): 141–146.

DOI: https://doi.org/10.1115/1.2792081

Published Online: June 1, 1995

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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure

Journal citation

NARROW

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

Hygrothermal Cracking Analysis of Plastic IC Package

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

Experimental Investigation of the Formation of Surface Mount Solder Joints

Ball Grid Array Thermomechanical Response During Reflow Assembly

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Study of Print Release Process in Solder Paste Printing

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

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