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Journal Articles

PCB Defect Image Recognition Based On The Multi-Model Fusion Algorithm

Accepted Manuscript
Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: November 20, 2023
View Article titled, PCB Defect Image Recognition Based On The Multi-Model Fusion Algorithm
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Topics: Algorithms, Artificial neural networks, Electronic products, Flaw detection, Network models, Printed circuit boards
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Article titled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
https://doi.org/10.1115/1.4046555
Published Online: March 18, 2020
View Article titled, Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
View Article titled, Reliability Considerations for Oil Immersion-Cooled Data Centers
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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041001.
Paper No: EP-17-1120
https://doi.org/10.1115/1.4040552
Published Online: July 3, 2018
View Article titled, Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Article titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
View Article titled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
https://doi.org/10.1115/1.4035019
Published Online: November 23, 2016
View Article titled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Topics: Circuits, Computers, Printed circuit boards, Hardware
Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
https://doi.org/10.1115/1.4033109
Published Online: April 19, 2016
View Article titled, Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation
Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2016, 138(1): 010201.
Paper No: EP-16-1019
https://doi.org/10.1115/1.4032748
Published Online: March 10, 2016
View Article titled, Special Section on InterPACK 2015
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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
https://doi.org/10.1115/1.4032495
Published Online: March 10, 2016
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board
Open the PDF for Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board in another window
Topics: Damping, Printed circuit boards, Microbeams
Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
https://doi.org/10.1115/1.4028516
Published Online: October 15, 2014
View Article titled, Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure
Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
https://doi.org/10.1115/1.4027425
Published Online: May 12, 2014
View Article titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
https://doi.org/10.1115/1.4005091
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
https://doi.org/10.1115/1.4005090
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
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Topics: Printed circuit boards, Shock (Mechanics), Manufacturing
Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
https://doi.org/10.1115/1.4004830
Published Online: September 30, 2011
View Article titled, Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances
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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature