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Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109.

Paper No: EP-21-1016

DOI: https://doi.org/10.1115/1.4052536

Published Online: October 14, 2021

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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu

J. Electron. Packag. March 2022, 144(1): 011005.

Paper No: EP-20-1097

DOI: https://doi.org/10.1115/1.4049813

Published Online: August 6, 2021

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Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering

Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. June 2020, 142(2): 021008.

Paper No: EP-19-1006

DOI: https://doi.org/10.1115/1.4046555

Published Online: March 18, 2020

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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure

Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay

J. Electron. Packag. June 2019, 141(2): 021007.

Paper No: EP-18-1050

DOI: https://doi.org/10.1115/1.4042979

Published Online: April 10, 2019

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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity

Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell

J. Electron. Packag. December 2018, 140(4): 041001.

Paper No: EP-17-1120

DOI: https://doi.org/10.1115/1.4040552

Published Online: July 3, 2018

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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties

Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

J. Electron. Packag. March 2018, 140(1): 010904.

Paper No: EP-17-1093

DOI: https://doi.org/10.1115/1.4039020

Published Online: March 2, 2018

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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy

Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. September 2017, 139(3): 031001.

Paper No: EP-15-1102

DOI: https://doi.org/10.1115/1.4036187

Published Online: June 14, 2017

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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires

Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee

J. Electron. Packag. March 2017, 139(1): 011003.

Paper No: EP-16-1103

DOI: https://doi.org/10.1115/1.4035241

Published Online: December 7, 2016

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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance

Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama

J. Electron. Packag. March 2017, 139(1): 010801.

Paper No: EP-16-1092

DOI: https://doi.org/10.1115/1.4035019

Published Online: November 23, 2016

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Topics: Circuits, Computers, Printed circuit boards, Hardware

Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz

J. Electron. Packag. June 2016, 138(2): 021004.

Paper No: EP-16-1035

DOI: https://doi.org/10.1115/1.4033109

Published Online: April 19, 2016

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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation

Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

DOI: https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. March 2016, 138(1): 010914.

Paper No: EP-15-1101

DOI: https://doi.org/10.1115/1.4032495

Published Online: March 10, 2016

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Topics: Damping, Printed circuit boards, Microbeams

Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus

J. Electron. Packag. March 2015, 137(1): 011009.

Paper No: EP-14-1062

DOI: https://doi.org/10.1115/1.4028516

Published Online: October 15, 2014

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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure

Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007.

Paper No: EP-13-1074

DOI: https://doi.org/10.1115/1.4027425

Published Online: May 12, 2014

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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041012.

DOI: https://doi.org/10.1115/1.4005091

Published Online: December 9, 2011

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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041010.

DOI: https://doi.org/10.1115/1.4005090

Published Online: December 9, 2011

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Topics: Printed circuit boards, Shock (Mechanics), Manufacturing

Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires

J. Electron. Packag. September 2011, 133(3): 031013.

DOI: https://doi.org/10.1115/1.4004830

Published Online: September 30, 2011

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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

Journal Articles

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Reinhard E. Powell, I. Charles Ume

J. Electron. Packag. June 2009, 131(2): 021006.

DOI: https://doi.org/10.1115/1.3103938

Published Online: April 1, 2009

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Topics: Warping, Printed circuit boards, Measurement systems, Resolution (Optics)

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Journal citation

NARROW

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Reliability Considerations for Oil Immersion-Cooled Data Centers

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Thermal Metamaterials for Heat Flow Control in Electronics

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

Special Section on InterPACK 2015

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

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