1-20 of 97
Pressure drop
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

Accepted Manuscript
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant Narumanchi, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1026
https://doi.org/10.1115/1.4062869
Published Online: June 29, 2023
View Article titled, Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink
Open the PDF for Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink in another window
Topics: Cooling, Heat sinks, Manifolds, Silicon, Electronics, Reliability, Thermal management, Additive manufacturing, Algorithms, Copper
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Article titled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Article titled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Open the PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers in another window
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Open the PDF for Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate in another window
Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Open the PDF for Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink in another window
Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Open the PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers in another window
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Article titled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Open the PDF for Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers in another window
Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041007.
Paper No: EP-21-1084
https://doi.org/10.1115/1.4052537
Published Online: November 22, 2021
View Article titled, Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
Open the PDF for Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel in another window
Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop
Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041105.
Paper No: EP-21-1112
https://doi.org/10.1115/1.4052400
Published Online: October 6, 2021
View Article titled, Reduced Order Design Optimization of Liquid Cooled Heat Sinks
Open the PDF for Reduced Order Design Optimization of Liquid Cooled Heat Sinks in another window
Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Open the PDF for A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics in another window
Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041102.
Paper No: EP-21-1081
https://doi.org/10.1115/1.4051942
Published Online: August 20, 2021
View Article titled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
Open the PDF for Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control in another window
Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves
Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
https://doi.org/10.1115/1.4049018
Published Online: January 19, 2021
View Article titled, Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
Open the PDF for Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling in another window
Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
https://doi.org/10.1115/1.4047883
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling in another window
Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers
Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041005.
Paper No: EP-18-1069
https://doi.org/10.1115/1.4044130
Published Online: July 12, 2019
View Article titled, Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
Open the PDF for Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers in another window
Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
Open the PDF for Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger in another window
Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
Open the PDF for Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers in another window
Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Open the PDF for Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop in another window
Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
https://doi.org/10.1115/1.4037152
Published Online: July 10, 2017
View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
Open the PDF for Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator in another window
Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Article titled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Open the PDF for Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps in another window
Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management