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Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2023, 145(2): 021008.

Paper No: EP-22-1046

DOI: https://doi.org/10.1115/1.4055468

Published Online: September 28, 2022

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Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel

J. Electron. Packag. December 2022, 144(4): 041007.

Paper No: EP-21-1084

DOI: https://doi.org/10.1115/1.4052537

Published Online: November 22, 2021

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Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop

Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

J. Electron. Packag. December 2022, 144(4): 041008.

Paper No: EP-21-1115

DOI: https://doi.org/10.1115/1.4052324

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop

Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic

J. Electron. Packag. December 2021, 143(4): 041105.

Paper No: EP-21-1112

DOI: https://doi.org/10.1115/1.4052400

Published Online: October 6, 2021

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Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102.

Paper No: EP-21-1081

DOI: https://doi.org/10.1115/1.4051942

Published Online: August 20, 2021

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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031117.

Paper No: EP-20-1030

DOI: https://doi.org/10.1115/1.4047846

Published Online: August 17, 2020

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Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031118.

Paper No: EP-20-1032

DOI: https://doi.org/10.1115/1.4047883

Published Online: August 17, 2020

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Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008.

Paper No: EP-18-1108

DOI: https://doi.org/10.1115/1.4043482

Published Online: May 17, 2019

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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

DOI: https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 021001.

Paper No: EP-17-1126

DOI: https://doi.org/10.1115/1.4039475

Published Online: May 9, 2018

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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature

Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome

J. Electron. Packag. September 2017, 139(3): 031008.

Paper No: EP-17-1023

DOI: https://doi.org/10.1115/1.4037152

Published Online: July 10, 2017

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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat

Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006.

Paper No: EP-16-1097

DOI: https://doi.org/10.1115/1.4035387

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management

Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005.

Paper No: EP-16-1083

DOI: https://doi.org/10.1115/1.4035386

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature

Journal Articles

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer

J. Electron. Packag. June 2016, 138(2): 021005.

Paper No: EP-15-1084

DOI: https://doi.org/10.1115/1.4033309

Published Online: April 25, 2016

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Topics: Coolants, Cooling, Flow (Dynamics), Heat, Pressure drop, Temperature, Vehicles, Sensors, Silicon

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Journal citation

NARROW

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

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