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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2023, 145(2): 021008.

Paper No: EP-22-1046

DOI: https://doi.org/10.1115/1.4055468

Published Online: September 28, 2022

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Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop

Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik

J. Electron. Packag. December 2022, 144(4): 040801.

Paper No: EP-21-1129

DOI: https://doi.org/10.1115/1.4054184

Published Online: April 28, 2022

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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014.

Paper No: EP-21-1134

DOI: https://doi.org/10.1115/1.4053433

Published Online: February 7, 2022

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators

Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006.

Paper No: EP-21-1075

DOI: https://doi.org/10.1115/1.4052175

Published Online: November 22, 2021

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Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure

Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005.

Paper No: EP-21-1036

DOI: https://doi.org/10.1115/1.4052246

Published Online: November 22, 2021

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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties

Karl F. Schoch, Jr., Philip A. Panackal, M. Garrett Bimstefer, Amanda N. Brocki, Daniel N. Urban

J. Electron. Packag. September 2022, 144(3): 031008.

Paper No: EP-21-1040

DOI: https://doi.org/10.1115/1.4052076

Published Online: September 15, 2021

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Topics: Putties, Shapes, Stress, Stiffness, Compression, Pressure

Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102.

Paper No: EP-21-1081

DOI: https://doi.org/10.1115/1.4051942

Published Online: August 20, 2021

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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves

Journal Articles

Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin

J. Electron. Packag. September 2021, 143(3): 031005.

Paper No: EP-20-1106

DOI: https://doi.org/10.1115/1.4049175

Published Online: January 19, 2021

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Topics: Flow (Dynamics), Pressure, Ball-Grid-Array packaging

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041002.

Paper No: EP-19-1138

DOI: https://doi.org/10.1115/1.4048180

Published Online: September 4, 2020

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Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature

Journal Articles

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Sanket Girhe, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya

J. Electron. Packag. June 2021, 143(2): 021004.

Paper No: EP-20-1046

DOI: https://doi.org/10.1115/1.4048036

Published Online: September 3, 2020

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Topics: Computer simulation, Flow (Dynamics), Pressure, Rotors, Porous materials, Simulation, Modeling

Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington

J. Electron. Packag. March 2021, 143(1): 011010.

Paper No: EP-19-1130

DOI: https://doi.org/10.1115/1.4047576

Published Online: July 10, 2020

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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites

Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

J. Electron. Packag. September 2020, 142(3): 031114.

Paper No: EP-19-1110

DOI: https://doi.org/10.1115/1.4047356

Published Online: June 8, 2020

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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance

Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li

J. Electron. Packag. June 2020, 142(2): 021006.

Paper No: EP-19-1070

DOI: https://doi.org/10.1115/1.4046341

Published Online: March 9, 2020

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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting

Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005.

Paper No: EP-19-1105

DOI: https://doi.org/10.1115/1.4046164

Published Online: February 19, 2020

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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure

Journal Articles

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

Fei Chong Ng, Aizat Abas, M. Z. Abdullah

J. Electron. Packag. December 2019, 141(4): 041009.

Paper No: EP-19-1066

DOI: https://doi.org/10.1115/1.4044817

Published Online: October 18, 2019

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Topics: Flip-chip, Flow (Dynamics), Fluids, Pressure

2 3 4 5

Journal citation

NARROW

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Influence of Laser Soldering Temperatures on Through-Hole Component

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

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