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Journal Articles

Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder

G. Chen, Y. Y. Wang, X. H. Wang, Y. Cui, S. W. Shi, J. Yang, W. L. Xu, Q. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031003.
Paper No: EP-20-1130
https://doi.org/10.1115/1.4051753
Published Online: September 15, 2021
View Article titled, Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder
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Topics: Corrosion, Polarization (Electricity), Polarization (Light), Polarization (Waves), Stress
Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031108.
Paper No: EP-19-1132
https://doi.org/10.1115/1.4046934
Published Online: May 4, 2020
View Article titled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
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Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage
Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031010.
Paper No: EP-18-1096
https://doi.org/10.1115/1.4043479
Published Online: May 24, 2019
View Article titled, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering