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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

J. Electron. Packag. September 2023, 145(3): 031009.

Paper No: EP-22-1039

DOI: https://doi.org/10.1115/1.4056991

Published Online: March 20, 2023

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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

DOI: https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

J. Electron. Packag. December 2021, 143(4): 048001.

Paper No: EP-21-1128

DOI: https://doi.org/10.1115/1.4052403

Published Online: October 1, 2021

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Topics: Electronics, Engineers, Leadership, Mentoring, Packaging, Photonics

Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller

J. Electron. Packag. March 2022, 144(1): 011004.

Paper No: EP-20-1093

DOI: https://doi.org/10.1115/1.4049815

Published Online: August 6, 2021

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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature

Journal Articles

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang

J. Electron. Packag. March 2022, 144(1): 011001.

Paper No: EP-20-1071

DOI: https://doi.org/10.1115/1.4050198

Published Online: August 6, 2021

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Topics: Creep, Fatigue, Packaging, Reliability, Solder joints, Warping, Finite element analysis, Stress, Solders, Silicon

Journal Articles

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure

Zong-Tao Li, Jun-Hao Wu, Zhi-yao Ren, Yao-xing Song, Jia-Sheng Li

J. Electron. Packag. March 2022, 144(1): 011010.

Paper No: EP-20-1129

DOI: https://doi.org/10.1115/1.4050202

Published Online: August 6, 2021

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Topics: Electromagnetic scattering, Graphite, Light-emitting diodes, Nanoparticles, Packaging, Radiation (Physics)

Journal Articles

Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique

Zong-Tao Li, Jia-Yong Liang, Jia-Sheng Li, Jie-Xin Li, Yong Tang

J. Electron. Packag. June 2021, 143(2): 021002.

Paper No: EP-20-1041

DOI: https://doi.org/10.1115/1.4048034

Published Online: August 27, 2020

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Topics: Boron, Electromagnetic scattering, Light-emitting diodes, Nanoparticles, Radiation scattering, Reflection, Scattering (Physics), Quantum dots, Packaging, Geometry

Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301.

Paper No: EP-20-1092

DOI: https://doi.org/10.1115/1.4048039

Published Online: August 14, 2020

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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers

Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

J. Electron. Packag. March 2021, 143(1): 010801.

Paper No: EP-20-1051

DOI: https://doi.org/10.1115/1.4047414

Published Online: June 29, 2020

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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy

Journal Articles

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Jia-Sheng Li, Yong Tang, Zong-Tao Li, Wen-Quan Kang, Xin-Rui Ding, Bin-Hai Yu

J. Electron. Packag. December 2019, 141(4): 041006.

Paper No: EP-18-1071

DOI: https://doi.org/10.1115/1.4044475

Published Online: September 19, 2019

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Topics: Light-emitting diodes, Quantum dots, Packaging, Absorption, Light sources

Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. March 2020, 142(1): 011004.

Paper No: EP-19-1023

DOI: https://doi.org/10.1115/1.4044625

Published Online: September 19, 2019

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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives

Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo

J. Electron. Packag. December 2019, 141(4): 040804.

Paper No: EP-18-1089

DOI: https://doi.org/10.1115/1.4044624

Published Online: September 19, 2019

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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation

Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo

J. Electron. Packag. March 2020, 142(1): 010801.

Paper No: EP-18-1105

DOI: https://doi.org/10.1115/1.4044359

Published Online: September 19, 2019

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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)

Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau

J. Electron. Packag. December 2019, 141(4): 040801.

Paper No: EP-18-1088

DOI: https://doi.org/10.1115/1.4043341

Published Online: May 17, 2019

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Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching

Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li

J. Electron. Packag. September 2019, 141(3): 030301.

Paper No: EP-19-1036

DOI: https://doi.org/10.1115/1.4043484

Published Online: May 8, 2019

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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers

Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031005.

Paper No: EP-18-1076

DOI: https://doi.org/10.1115/1.4042982

Published Online: April 10, 2019

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Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy

Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang

J. Electron. Packag. March 2019, 141(1): 010301.

Paper No: EP-18-1120

DOI: https://doi.org/10.1115/1.4042803

Published Online: March 6, 2019

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Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry

Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi

J. Electron. Packag. December 2018, 140(4): 040801.

Paper No: EP-17-1128

DOI: https://doi.org/10.1115/1.4040828

Published Online: August 20, 2018

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Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat

2 3 4 5

Journal citation

NARROW

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Special Section on InterPACK2021

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure

Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique

Special Issue on InterPACK 2019 – Part 1

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Packaging for Laser-Based White Lighting: Status and Perspectives

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Special Issue on InterPACK 2018

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Special Section of Review Articles From Intel Corporation

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

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