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Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li

J. Electron. Packag. September 2023, 145(3): 031001.

Paper No: EP-22-1057

DOI: https://doi.org/10.1115/1.4056329

Published Online: December 9, 2022

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Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength

Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

J. Electron. Packag. June 2022, 144(2): 021113.

Paper No: EP-21-1059

DOI: https://doi.org/10.1115/1.4052715

Published Online: January 4, 2022

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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108.

Paper No: EP-21-1060

DOI: https://doi.org/10.1115/1.4052073

Published Online: October 6, 2021

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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

J. Electron. Packag. December 2020, 142(4): 041104.

Paper No: EP-20-1003

DOI: https://doi.org/10.1115/1.4047392

Published Online: June 23, 2020

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Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders

Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021007.

Paper No: EP-19-1085

DOI: https://doi.org/10.1115/1.4046163

Published Online: March 9, 2020

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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties

Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

DOI: https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

J. Electron. Packag. June 2018, 140(2): 020901.

Paper No: EP-17-1092

DOI: https://doi.org/10.1115/1.4039136

Published Online: May 9, 2018

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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties

Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui

J. Electron. Packag. September 2015, 137(3): 031005.

Paper No: EP-13-1135

DOI: https://doi.org/10.1115/1.4029836

Published Online: September 1, 2015

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Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders

Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi

J. Electron. Packag. March 2015, 137(1): 014501.

Paper No: EP-13-1116

DOI: https://doi.org/10.1115/1.4027992

Published Online: October 6, 2014

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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress

Journal Articles

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2012, 134(2): 021006.

DOI: https://doi.org/10.1115/1.4006142

Published Online: June 11, 2012

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Topics: Silicon chips, Stress, Mechanical properties, Flip-chip, Deformation, Copper

Journal Articles

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Ningbo Liao, Ping Yang, Miao Zhang, Wei Xue

J. Electron. Packag. June 2011, 133(2): 020901.

DOI: https://doi.org/10.1115/1.4003513

Published Online: June 7, 2011

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Topics: Mechanical properties, Nanoindentation, Simulation, Young's modulus, Molecular dynamics simulation, Heat transfer

Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang

J. Electron. Packag. June 2009, 131(2): 021004.

DOI: https://doi.org/10.1115/1.3103932

Published Online: April 1, 2009

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Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering

Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran

J. Electron. Packag. March 2009, 131(1): 011002.

DOI: https://doi.org/10.1115/1.3068296

Published Online: February 11, 2009

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Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation

Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu

J. Electron. Packag. December 2005, 127(4): 446–451.

DOI: https://doi.org/10.1115/1.2070090

Published Online: January 13, 2005

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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion

Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang

J. Electron. Packag. December 2005, 127(4): 530–536.

DOI: https://doi.org/10.1115/1.2070092

Published Online: December 22, 2004

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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics

Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,

J. Electron. Packag. June 2003, 125(2): 186–191.

DOI: https://doi.org/10.1115/1.1568126

Published Online: June 10, 2003

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Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics

Journal Articles

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel

J. Electron. Packag. December 2002, 124(4): 367–370.

DOI: https://doi.org/10.1115/1.1497628

Published Online: December 12, 2002

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Topics: Adhesive joints, Adhesives, Mechanical properties, Resins, Fillers (Materials), Experimental design, Adhesion, Finishing

Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang

J. Electron. Packag. March 2000, 122(1): 74.

DOI: https://doi.org/10.1115/1.483136

Published Online: March 1, 2000

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Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment

Journal Articles

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

X. Q. Shi, W. Zhou, H. L. J. Pang, Z. P. Wang

J. Electron. Packag. September 1999, 121(3): 179–185.

DOI: https://doi.org/10.1115/1.2792681

Published Online: September 1, 1999

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Topics: Alloys, Mechanical properties, Solders, Temperature, Testing

Journal Articles

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

H. Doi, K. Kawano, A. Yasukawa, T. Sato

J. Electron. Packag. December 1998, 120(4): 322–327.

DOI: https://doi.org/10.1115/1.2792641

Published Online: December 1, 1998

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Topics: Flat heat pipes, Flip-chip devices, Reliability, Solder joints, Delamination, Failure mechanisms, Fatigue life, Flip-chip packages, Mechanical properties, Shapes

Journal citation

NARROW

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Electrically Conductive Adhesive Formulations for SMT Applications

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

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