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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael Azarian, Daniel Hines, Siddhartha Das, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag.

Paper No: EP-23-1012

https://doi.org/10.1115/1.4063541

Published Online: September 29, 2023

View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Topics: Aerosols, Circuits, Modeling, Temperature, Testing, Electronics, Electric fields, Manufacturing, Reliability, Breakdown (Electricity)

Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess

J. Electron. Packag. December 2021, 143(4): 041101.

Paper No: EP-21-1034

https://doi.org/10.1115/1.4051752

Published Online: August 9, 2021

View Article titled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability

Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 031007.

Paper No: EP-20-1045

https://doi.org/10.1115/1.4049814

Published Online: February 19, 2021

View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat

Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden

J. Electron. Packag. September 2020, 142(3): 031116.

Paper No: EP-20-1018

https://doi.org/10.1115/1.4047845

Published Online: August 5, 2020

View Article titled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage

Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler

J. Electron. Packag. December 2020, 142(4): 041103.

Paper No: EP-19-1096

https://doi.org/10.1115/1.4047469

Published Online: June 23, 2020

View Article titled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Topics: Data centers, Dust, Leakage, Particulate matter, Sensors

Journal Articles

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Hongfeng Jia, Huabin Yu, Zhongjie Ren, Chong Xing, Zhongling Liu, Yang Kang, Haiding Sun

J. Electron. Packag. September 2020, 142(3): 031115.

Paper No: EP-20-1017

https://doi.org/10.1115/1.4047286

Published Online: June 8, 2020

View Article titled, Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Topics: Electrons, Light-emitting diodes, Leakage

Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang

J. Electron. Packag. September 2020, 142(3): 031108.

Paper No: EP-19-1132

https://doi.org/10.1115/1.4046934

Published Online: May 4, 2020

View Article titled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage

Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

J. Electron. Packag. September 2019, 141(3): 031004.

Paper No: EP-18-1075

https://doi.org/10.1115/1.4042983

Published Online: April 10, 2019

View Article titled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature

Journal Articles

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

J. Electron. Packag. March 2018, 140(1): 010907.

Paper No: EP-17-1109

https://doi.org/10.1115/1.4039028

Published Online: March 2, 2018

View Article titled, Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Topics: Air flow, Design, Leakage, Tiles, Temperature, Computational fluid dynamics, Simulation, Flow (Dynamics), Pressure

Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava

J. Electron. Packag. June 2015, 137(2): 021010.

Paper No: EP-14-1016

https://doi.org/10.1115/1.4029344

Published Online: June 1, 2015

View Article titled, Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Topics: Air flow, Calibration, Computational fluid dynamics, Containment, Data centers, Flow (Dynamics), Leakage, Stress, Temperature, Tiles

Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang

J. Electron. Packag. September 2014, 136(3): 031015.

Paper No: EP-13-1050

https://doi.org/10.1115/1.4028013

Published Online: July 24, 2014

View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature

Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader

J. Electron. Packag. December 2012, 134(4): 041009.

https://doi.org/10.1115/1.4007744

Published Online: November 26, 2012

View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat

Journal Articles

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Chung-Feng Jeffrey Kuo, Hui-Ta Chen, Te-Li Su, Jr-Da Huang

J. Electron. Packag. December 2010, 132(4): 041006.

https://doi.org/10.1115/1.4002727

Published Online: November 24, 2010

View Article titled, Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Topics: Bonding, Flip-chip, Light-emitting diodes, Leakage, Taguchi methods

Journal Articles

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, Sheng Liu

J. Electron. Packag. December 2009, 131(4): 041001.

https://doi.org/10.1115/1.3144148

Published Online: October 16, 2009

View Article titled, Measurement of Leak Rate for MEMS Vacuum Packaging

Topics: Leakage, Packaging, Vacuum, Pressure, Flow (Dynamics)

Journal Articles

Lifetime Estimation of Moems Devices

T. Bar-Kohany, A. Stern

J. Electron. Packag. June 2007, 129(2): 144–148.

https://doi.org/10.1115/1.2721085

Published Online: June 13, 2006

View Article titled, Lifetime Estimation of Moems Devices

Topics: Cavities, Flow (Dynamics), Leakage, Microoptoelectromechanical systems, Pressure, Water, Electrical conductance

Journal Articles

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

M. Baris Dogruoz, Alfonso Ortega, Russell V. Westphal

J. Electron. Packag. March 2006, 128(1): 53–60.

https://doi.org/10.1115/1.2159009

Published Online: July 30, 2005

View Article titled, A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

Topics: Flow (Dynamics), Heat sinks, Leakage, Heat transfer, Pressure drop

Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

J. Electron. Packag. June 2003, 125(2): 294–301.

https://doi.org/10.1115/1.1571076

Published Online: June 10, 2003

View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging

Journal Articles

Reliable Ceramic Window Design for Electronic Devices

Hsien-Yang Yeh

J. Electron. Packag. September 1992, 114(3): 349–352.

https://doi.org/10.1115/1.2905462

Published Online: September 1, 1992

View Article titled, Reliable Ceramic Window Design for Electronic Devices

Topics: Ceramics, Design, Fracture (Materials), Vacuum, Leakage, Traveling waves, Approximation, Fracture mechanics, Heating, Plates (structures)

Journal Articles

Closing of Surface Flaws Under Compressive Loading

W. E. Warren, D. E. Amos

J. Electron. Packag. March 1991, 113(1): 63–67.

https://doi.org/10.1115/1.2905368

Published Online: March 1, 1991

View Article titled, Closing of Surface Flaws Under Compressive Loading

Topics: Deformation, Displacement, Electronic components, Leakage, Seals, Stress

Journal Articles

Finite Element Modeling for Optimizing Hermetic Package Reliability

J. H. Lau, L. B. Lian-Mueller

J. Electron. Packag. December 1989, 111(4): 255–260.

https://doi.org/10.1115/1.3226544

Published Online: December 1, 1989

View Article titled, Finite Element Modeling for Optimizing Hermetic Package Reliability

Topics: Finite element analysis, Modeling, Reliability, Design, Microwaves, Construction, Finite element methods, Finite element model, Leakage, Thermal stresses

Journal citation

NARROW

Manuscript

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Measurement of Leak Rate for MEMS Vacuum Packaging

Lifetime Estimation of Moems Devices

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Reliable Ceramic Window Design for Electronic Devices

Closing of Surface Flaws Under Compressive Loading

Finite Element Modeling for Optimizing Hermetic Package Reliability

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