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Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger

J. Electron. Packag. March 2023, 145(1): 011201.

Paper No: EP-21-1153

DOI: https://doi.org/10.1115/1.4054651

Published Online: July 7, 2022

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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118.

Paper No: EP-21-1038

DOI: https://doi.org/10.1115/1.4053948

Published Online: March 28, 2022

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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks

Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014.

Paper No: EP-21-1134

DOI: https://doi.org/10.1115/1.4053433

Published Online: February 7, 2022

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators

Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 024501.

Paper No: EP-21-1070

DOI: https://doi.org/10.1115/1.4053363

Published Online: January 28, 2022

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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow

Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur

J. Electron. Packag. December 2021, 143(4): 041109.

Paper No: EP-21-1087

DOI: https://doi.org/10.1115/1.4052814

Published Online: November 5, 2021

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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state

Includes: Supplementary data

Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic

J. Electron. Packag. December 2021, 143(4): 041105.

Paper No: EP-21-1112

DOI: https://doi.org/10.1115/1.4052400

Published Online: October 6, 2021

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Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks

Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104.

Paper No: EP-20-1142

DOI: https://doi.org/10.1115/1.4052074

Published Online: September 24, 2021

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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials

Journal Articles

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci

J. Electron. Packag. June 2022, 144(2): 021103.

Paper No: EP-21-1019

DOI: https://doi.org/10.1115/1.4052068

Published Online: September 15, 2021

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Topics: Design, Heat sinks, Optimization, Temperature

Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic

J. Electron. Packag. June 2021, 143(2): 020903.

Paper No: EP-20-1081

DOI: https://doi.org/10.1115/1.4049294

Published Online: February 22, 2021

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Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing

Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi

J. Electron. Packag. September 2021, 143(3): 031006.

Paper No: EP-19-1118

DOI: https://doi.org/10.1115/1.4049564

Published Online: February 19, 2021

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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)

Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 030801.

Paper No: EP-19-1124

DOI: https://doi.org/10.1115/1.4048861

Published Online: January 19, 2021

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Topics: Heat sinks, Metal foams, Heat transfer

Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink

J. Electron. Packag. December 2020, 142(4): 041108.

Paper No: EP-20-1019

DOI: https://doi.org/10.1115/1.4047497

Published Online: June 26, 2020

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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection

Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

J. Electron. Packag. September 2020, 142(3): 031114.

Paper No: EP-19-1110

DOI: https://doi.org/10.1115/1.4047356

Published Online: June 8, 2020

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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance

Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. March 2021, 143(1): 011006.

Paper No: EP-19-1100

DOI: https://doi.org/10.1115/1.4046756

Published Online: June 4, 2020

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Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids

Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 014502.

Paper No: EP-19-1039

DOI: https://doi.org/10.1115/1.4044774

Published Online: September 24, 2019

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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks

Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham

J. Electron. Packag. December 2019, 141(4): 041001.

Paper No: EP-18-1031

DOI: https://doi.org/10.1115/1.4043406

Published Online: May 8, 2019

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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages

Journal Articles

Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach

Ritunesh Kumar, Gurjeet Singh, Dariusz Mikielewicz

J. Electron. Packag. June 2019, 141(2): 021009.

Paper No: EP-18-1111

DOI: https://doi.org/10.1115/1.4043158

Published Online: April 10, 2019

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Topics: Flow (Dynamics), Heat sinks, Microchannels, Temperature, Design, Heat transfer, Fluids

Journal Articles

Simultaneous Optimization of an Array of Heat Sinks

Georgios Karamanis, Marc Hodes

J. Electron. Packag. June 2019, 141(2): 021001.

Paper No: EP-18-1068

DOI: https://doi.org/10.1115/1.4042668

Published Online: February 25, 2019

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat sinks, Optimization, Circuits, Coolants, Modeling

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Journal citation

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Supplemental Material

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach

Simultaneous Optimization of an Array of Heat Sinks

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