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Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. June 2020, 142(2): 021008.

Paper No: EP-19-1006

DOI: https://doi.org/10.1115/1.4046555

Published Online: March 18, 2020

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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure

Journal Articles

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, F. X. Che

J. Electron. Packag. December 2007, 129(4): 496–503.

DOI: https://doi.org/10.1115/1.2809442

Published Online: August 27, 2007

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Topics: Cycles, Density, Displacement, Fatigue, Fatigue testing, Finishes, Finite element analysis, High temperature, Lead-free solders, Manufacturing

Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

J. Electron. Packag. December 2004, 126(4): 560–564.

DOI: https://doi.org/10.1115/1.1827271

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis

Journal Articles

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate

J. Electron. Packag. September 2003, 125(3): 426–430.

DOI: https://doi.org/10.1115/1.1602707

Published Online: September 17, 2003

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Topics: Ball-Grid-Array packaging, Finite element analysis, Modeling, Reliability, Solder joints, Solders, Temperature, Tin, Surface mount technology, Diffusion (Physics)

Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan

J. Electron. Packag. December 1999, 121(4): 249–254.

DOI: https://doi.org/10.1115/1.2793848

Published Online: December 1, 1999

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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating

Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince

J. Electron. Packag. December 1997, 119(4): 294–300.

DOI: https://doi.org/10.1115/1.2792252

Published Online: December 1, 1997

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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure

Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. S. Desai, J. Chia, T. Kundu, J. L. Prince

J. Electron. Packag. December 1997, 119(4): 301–309.

DOI: https://doi.org/10.1115/1.2792253

Published Online: December 1, 1997

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Topics: Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress

Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao

J. Electron. Packag. September 1997, 119(3): 163–170.

DOI: https://doi.org/10.1115/1.2792229

Published Online: September 1, 1997

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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations

Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker

J. Electron. Packag. December 1996, 118(4): 244–249.

DOI: https://doi.org/10.1115/1.2792159

Published Online: December 1, 1996

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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging

Journal Articles

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi

J. Electron. Packag. September 1996, 118(3): 164–169.

DOI: https://doi.org/10.1115/1.2792147

Published Online: September 1, 1996

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Topics: Constitutive equations, Fatigue failure, Solders, Viscoplasticity, Alloys, Deformation, Density, Compression, Creep, Fatigue life

Journal Articles

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

S. Ling, A. Dasgupta

J. Electron. Packag. June 1996, 118(2): 72–79.

DOI: https://doi.org/10.1115/1.2792135

Published Online: June 1, 1996

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Topics: Solder joints, Stress analysis (Engineering), Surface mount packaging, Stress, Fatigue, Creep, Electronic packages, Deformation, Finite element analysis, Modeling

Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder

J. Electron. Packag. June 1996, 118(2): 62–66.

DOI: https://doi.org/10.1115/1.2792133

Published Online: June 1, 1996

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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting

Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan

J. Electron. Packag. June 1995, 117(2): 141–146.

DOI: https://doi.org/10.1115/1.2792081

Published Online: June 1, 1995

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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure

Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot

J. Electron. Packag. September 1994, 116(3): 184–190.

DOI: https://doi.org/10.1115/1.2905684

Published Online: September 1, 1994

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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage

Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner

J. Electron. Packag. June 1994, 116(2): 83–88.

DOI: https://doi.org/10.1115/1.2905509

Published Online: June 1, 1994

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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design

Journal Articles

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael

J. Electron. Packag. September 1993, 115(3): 225–232.

DOI: https://doi.org/10.1115/1.2909322

Published Online: September 1, 1993

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Topics: Adhesion, Acoustics, Cracking (Materials), Deformation, Delamination, Design, Epoxy adhesives, Epoxy resins, Fatigue failure, Finite element analysis

Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1993, 115(1): 34–38.

DOI: https://doi.org/10.1115/1.2909299

Published Online: March 1, 1993

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Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation

Journal Articles

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

Yifan Guo, Charles G. Woychik

J. Electron. Packag. March 1992, 114(1): 88–92.

DOI: https://doi.org/10.1115/1.2905446

Published Online: March 1, 1992

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Topics: Interferometry, Solder joints, Strain measurement, Surface mount components, Reliability, Solders, Thermal expansion, Dimensions, Electronic packages, Failure

Journal Articles

A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

Jun Ming Hu, Michael Pecht, Abhijit Dasgupta

J. Electron. Packag. September 1991, 113(3): 275–285.

DOI: https://doi.org/10.1115/1.2905407

Published Online: September 1, 1991

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Topics: Fatigue life, Microelectronic devices, Wire bonding, Wire, Fatigue failure, Reliability, Stress, Temperature, Uncertainty, Bonding

Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen

J. Electron. Packag. March 1991, 113(1): 58–62.

DOI: https://doi.org/10.1115/1.2905367

Published Online: March 1, 1991

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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films

Journal citation

NARROW

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Alternative Curing Methods for FCOB Underfill

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

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