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Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111.

Paper No: EP-21-1103

DOI: https://doi.org/10.1115/1.4052669

Published Online: November 5, 2021

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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities

Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104.

Paper No: EP-20-1142

DOI: https://doi.org/10.1115/1.4052074

Published Online: September 24, 2021

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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials

Journal Articles

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao

J. Electron. Packag. March 2022, 144(1): 011002.

Paper No: EP-20-1077

DOI: https://doi.org/10.1115/1.4051025

Published Online: August 6, 2021

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Topics: Alloys, Composite materials, Nanoparticles, Solders, Tin, Tensile strength

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo

J. Electron. Packag. September 2020, 142(3): 031101.

Paper No: EP-19-1109

DOI: https://doi.org/10.1115/1.4046763

Published Online: April 17, 2020

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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum

Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi

J. Electron. Packag. June 2020, 142(2): 021012.

Paper No: EP-19-1087

DOI: https://doi.org/10.1115/1.4046620

Published Online: April 6, 2020

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Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation

Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang

J. Electron. Packag. September 2018, 140(3): 031006.

Paper No: EP-17-1110

DOI: https://doi.org/10.1115/1.4040204

Published Online: June 11, 2018

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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver

Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

J. Electron. Packag. March 2018, 140(1): 010904.

Paper No: EP-17-1093

DOI: https://doi.org/10.1115/1.4039020

Published Online: March 2, 2018

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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy

Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim

J. Electron. Packag. December 2017, 139(4): 041007.

Paper No: EP-17-1007

DOI: https://doi.org/10.1115/1.4038028

Published Online: October 13, 2017

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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)

Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

J. Electron. Packag. March 2016, 138(1): 010906.

Paper No: EP-15-1094

DOI: https://doi.org/10.1115/1.4032493

Published Online: March 10, 2016

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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping

Journal Articles

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

Dhanesh Thomas, Mailadil T. Sebastian

J. Electron. Packag. September 2014, 136(3): 031002.

Paper No: EP-12-1085

DOI: https://doi.org/10.1115/1.4027089

Published Online: May 5, 2014

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Topics: Composite materials, Fillers (Materials), Microwaves

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht

J. Electron. Packag. June 2012, 134(2): 021009.

DOI: https://doi.org/10.1115/1.4006704

Published Online: June 11, 2012

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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms

Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee

J. Electron. Packag. June 2012, 134(2): 021004.

DOI: https://doi.org/10.1115/1.4006705

Published Online: June 11, 2012

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Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver

Journal Articles

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Lin Hu, William Evans, Pawel Keblinski

J. Electron. Packag. June 2011, 133(2): 021002.

DOI: https://doi.org/10.1115/1.4003865

Published Online: June 22, 2011

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Topics: Composite materials, Nanoparticles, Particulate matter, Simulation, Thermal conductivity, Wetting, Self-assembly, Molecular dynamics simulation

Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon

J. Electron. Packag. June 2011, 133(2): 020905.

DOI: https://doi.org/10.1115/1.4003988

Published Online: June 7, 2011

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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity

Journal Articles

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, Hong He

J. Electron. Packag. December 2009, 131(4): 041006.

DOI: https://doi.org/10.1115/1.4000210

Published Online: October 21, 2009

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Topics: Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Thermal conductivity, Epoxy adhesives, Finite element analysis

Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy

J. Electron. Packag. June 2008, 130(2): 021004.

DOI: https://doi.org/10.1115/1.2912185

Published Online: April 25, 2008

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Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity

Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang

J. Electron. Packag. December 2007, 129(4): 469–472.

DOI: https://doi.org/10.1115/1.2804097

Published Online: April 4, 2007

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Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites

Journal Articles

Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks

Ta-Wei Lin, Ming-Chang Wu, Li-Kang Liu, Chun-Jen Fang, Ying-Huei Hung

J. Electron. Packag. March 2006, 128(1): 82–91.

DOI: https://doi.org/10.1115/1.2161426

Published Online: June 4, 2005

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Topics: Cooling, Heat sinks, Heat transfer, Reynolds number, Steady state, Transients (Dynamics), Nozzles, Composite materials, Temperature distribution

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Journal citation

NARROW

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Thermal Metamaterials for Heat Flow Control in Electronics

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks

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